Abstract:This experiment used a magnetic concentrator and multi‐stage power control to improve the temperature uniformity of a mobile vacuum imprinting platform. The feasibility of large‐area imprinting was achieved. Hot embossing is a low‐cost and flexible method for fabricating microstructures and nanostructures on polymers. However, the conventional hot embossing process poses two challenges: First, the plates that are used do not provide uniform pressure, and the size of the chamber limits the imprinting area. Second, heating with thick metal plates significantly lengthens cycle time. Finally, the uniformity of temperature also affects the embossing results. To achieve a high heating rate and uniform pressure over a large area, this study combined an induction heating system and roll‐to‐plate hot embossing. A movable plate was used to move the mold through the induction coil, increasing the heating area and overcoming limitations related to the embossing area posed by the coil length. The imprinting area reached 100 × 100 mm2. In addition, the temperature difference was less than 20°C at each molding temperature range from 150°C to 190°C. The mold and the substrate were placed on a vacuum absorber to prevent deformation and slippage of the mold and provide preloading and packing pressure. Cooling fans were employed to improve cooling efficiency. Experimental replication yielded replication rates higher than 97% at 190°C and 5 kgf/cm2 with a cycle time of approximately 2 minutes. To verify the feasibility of the process, V‐groove microstructures were successfully fabricated using a movable induction heating roller embossing facility. Highlights The feasibility of the moving induction heating roller embossing process. A vacuum movable platform prevents deformation and slippage of the substrate. Improve the temperature uniformity of the movable platform.

Roll-to-roll Hot Embossing System with Shape Preserving Mechanism for the Large-Area Fabrication of Microstructures.

Experimental studies on a novel roll-to-roll powder hot embossing for large-area fabrication of micropyramid arrays on polymers

Experimental Investigation on the Large-Area Fabrication of Micro-Pyramid Arrays by Roll-To-Roll Hot Embossing on Pvc Film

Roll-to-Roll Powder Hot Embossing Process for Fabrication of Micro-Structures on Polymer Film

Flow Behavior of Polymers During the Roll-To-Roll Hot Embossing Process

Mechanism of forming defects in roll-to-roll hot embossing of micro-pyramid arrays I: experiments

Mechanism of forming defects in roll-to-roll hot embossing of micro-pyramid arrays: II. Numerical study

Research on Optimization of the Hot Embossing Process

Study on Polymer Flow Profile in Micro Hot Embossing

Optimization of Control Parameters in Micro Hot Embossing

Experimental studies on micro powder hot embossing for high-aspect-ratio microstructures with ultra-high molecular weight polyethylene powders

Roll-to-plate micro-imprinting of large-area surface micro features: Experiments and a local simulation method

Replication of large‐area microstructures by combining movable induction heating and roller hot embossing

Micro Structure Fabrication with a Simplified Hot Embossing Method

Experimental Study on the Hot Embossing Polymer Microfluidic Chip

Experimental Study on the Fabrication of the Light Guide Plate with Hot Embossing Method

Enhanced Polymer Filling and Uniform Shrinkage of Polymer and Mold in A Hot Embossing Process

Investigation of hot roller embossing for microfluidic devices

Defects in Micro Hot Embossing Process

Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process

Research on Heat Transfer for Hot Embossing of Polymeric Microfluidic Chips