Micro Structure Fabrication with a Simplified Hot Embossing Method

Yong He,WenBin Wu,Ting Zhang,JianZhong Fu

DOI: https://doi.org/10.1039/c5ra01410g

IF: 4.036

2015-01-01

RSC Advances

Abstract:A facile hot embossing method—low pressure hot embossing (LPHE)—is reported in this paper.

What problem does this paper attempt to address?

Experimental Study on the Hot Embossing Polymer Microfluidic Chip

He Yong,Fu Jianzhong,Chen Zichen

DOI: https://doi.org/10.3901/cjme.2008.03.087

IF: 2.964

2008-01-01

Chinese Journal of Mechanical Engineering

Abstract:Experiments are used to study the fabrication of polymer microfluidic chip with hot embossing method.The pattern fidelity with respect to the process parameters is analyzed. Experiment results show that the relationship between the imprint temperature and the microchannel width is approximately exponential.However,the depth of micro channel isn’t sensitive to the imprint temperature.When the imprint pressure is larger than 1 MPa and the imprint time is longer than 2 rain,the increasing of imprint pressure and holding time has little impact on the microchannel width. So over long holding time is not needed in hot embossing.Based on the experiment analysis,a series of optimization process parameters is obtained and a fine microfluidic chip is fabricated.The electrophoresis separation experiment are used to verify the microfluidic chip performance after bonding.The results show that 100bp-ladder DNA sample can be separated in less than 5 min successfully.
Experimental Study on the Fabrication of the Light Guide Plate with Hot Embossing Method

Yong He,Ting Zhang,Jianzhong Fu,Zichen Chen

DOI: https://doi.org/10.4028/www.scientific.net/amm.37-38.448

2010-01-01

Applied Mechanics and Materials

Abstract:To improve the quality of the light guide plate (LGP) made by injection molding, a fabrication method based on hot embossing was proposed. The silicon mold of the LGP with micro pyramid array was fabricated by wet chemical etching. The experiments of embossing the LGP were performed with a self-designed hot embossing machine. Orthogonal method was used to analyze the imprint pressure, the holding time, the imprint temperature and the width of pyramid with respect to the accuracy of replication (AOR). The experimental results show that the imprint temperature has the greatest effect on the AOR, followed by the imprint pressure and the holding time, while the width of micro pyramid has the minimal effect on the AOR. The increase of imprint temperature can obviously improve the pattern filling quality in the lower imprint pressure (0.7MPa). At last the optimal process parameters were obtained with the imprint pressure of 0.9MPa, the holding time of 5min and the imprint temperature of 130°C.
Three Dimension Micro-structure Soft Lithography Technology

刘伟庭,蔡强,郭希山,陈裕泉,王立人

DOI: https://doi.org/10.3969/j.issn.1004-1699.2002.02.011

2002-01-01

Abstract:This paper describes a novel microstructure fabrication technology based on soft lithography, which provides a convenient, effective, and low-cost method for the formation and manufacturing of micro and nanostructure. Also we discuss some key techniques of soft lithography, such as elastmeric stamp, replica molding. At last, the three-dimension micro-capillary and micro-valve is fabricated on the glass using soft lithography method.
Research on Heat Transfer for Hot Embossing of Polymeric Microfluidic Chips

Ren Yongli,Fu Jianzhong,Chen Zichen

DOI: https://doi.org/10.3321/j.issn:1003-8728.2005.11.027

2005-01-01

Abstract:Hot embossing is one of the main techniques for fabricating microfluidic chips in polymeric materials.Technical parameters have great impact on the formation quality of polymeric microfluidic chips.Based on the mechanism of hot embossing polymeric microfluidic chips,the paper analyses heat transfer of micro-mold,presents a model of transient-state heat transfer within a one-dimensional multilayered structure and simulates it by finite element method.Technical parameters such as time of heating are thus obtained.
Flow Behavior of Polymer During Micro Hot Embossing

HE Yong,FU Jian-zhong,CHEN Zi-chen

DOI: https://doi.org/10.3785/j.issn.1008-973x.2008.05.027

2008-01-01

Abstract:The micro hot embossing process was simulated by finite element method(FEM) to investigate the flow behavior of polymer in order to get better imprint quality.The influences of mold duty ratio,polymer thickness,imprint temperature on the imprint pressure,imprint time and polymer flow field were analyzed. Simulation shows that with the decrease of mold duty ratio,the flow profile of polymer changes from one peak to dual peak and from craggedness to flatness.Due to boundary effect,when the polymer thickness decreases,the polymer becomes hard to flow,which results in the needed imprint pressure increases rapidly.Inadequate imprint pressure or short imprint time can lead to low pattern fidelity.In the non-isothermal embossing process,when the polymer thickness is relatively large,the polymer viscous becomes low around the extrusion area due to high temperature gradient,and the phenomena of polymer climbing along the mold side can be observed.The simulation results agree well with the experimental data.
Defects in Micro Hot Embossing Process

HE Yong,FU Jian-zhong,XU Yue-tong,CHEN Zi-chen

DOI: https://doi.org/10.3785/j.issn.1008-973x.2009.01.016

2009-01-01

Abstract:The reason causing the structure defects induced in micro hot embossing process was investigated to get better product quality.The defects in the cooling and demolding step were analyzed with finite element method(FEM).The simulation results showed that large thermal stress concentration can be found in the cooling step due to the different coefficients of thermal expansion between the polymer and the mold,while keeping imprint pressure will aggravate the phenomenon and result in damage at the bottom of micro patterns.Fracture and necking can be easily induced by the adhesion between the polymer and the mold when demolding high aspect ratio patterns.Incline structures can be found when using manual demolding and wrap structure can be caused when using common demolding device.Hot embossing process was optimized and a new pneumatic demolding device was designed.Successful fabrication of fine patterns with high aspect ratio verified the improvements.
Optimization of Control Parameters in Micro Hot Embossing

Yong He,Jian-Zhong Fu,Chen

DOI: https://doi.org/10.1007/s00542-007-0497-8

2007-01-01

Microsystem Technologies

Abstract:The key control parameters in hot embossing (such as the imprint pressure, the imprint temperature, the holding time and the demolding temperature) can significantly impact on the pattern quality. The finite element method was used to analyze the embossing, cooling and demolding step to acquire the optimized process parameters. The simulation results show that the polymer flow has a reference to the imprint pressure, the imprint temperature and the holding time. While the adhesion force between the polymer and the mold can significantly influence the replication accuracy. Because of polymer flow, non-uniform pressure distribution can be observed and this results in the pattern height difference. The hydraulic pressure system was designed to acquire uniform pressure. Thermal stress caused by the difference of the thermal expansion coefficients between the mold and the polymer can induce stress concentration at the corner. If the demolding direction is not vertical to horizon, another stress concentration will appear. Excessive stress results in defects and causes fracture at the base part of the pattern during the demolding step. To eliminate the defects, cooling to a relative high temperature was introduced to reduce the stress concentration and an auto-demolding device was used to insure no additional stress was imported at the demolding step. The following experiment showed the successful fabrication of fine patterns with the optimized parameters.
A facile and low-cost micro fabrication material: flash foam

Yong He,Xiao Xiao,Yan Wu,Jian-zhong Fu

DOI: https://doi.org/10.1038/srep13522

IF: 4.6

2015-01-01

Scientific Reports

Abstract:Although many microfabrication methods have been reported, the preliminary replication templates used in most microfabrication still depend on the expensive and long-period photolithography. This paper explores an alternative replication templates based on a daily used material, flash foam (FF) and proposes a facile microfabrication method, flash foam stamp lithography (FFSL). When FF is exposed with a desired pattern mask, the negative of the pattern is transferred to its surface and micro structures are formed due to the shrinkage of the exposed area. As FF is commonly used in personal stamps, FFSL is very simple and cost-effective. In this paper, we demonstrated that FF is a good and low-cost template for many micro fabrication methods, such as micro casting and soft lithography. Thus, designing and fabricating micro structures at personal office immediately become possible with FFSL. Furthermore, we demonstrated that multi-scale micro structures can be easily fabricated by double exposure with FFSL. Skin textures is used as another case to demonstrate that FFSL can fabricate structures with different depth in a single exposure. As a result, FF shows a promising future in biology and analytical chemistry, such as rapid fabrication of point of care diagnostics and microfluidic analytical devices with low cost.
Mold Embossing - Based Soft Lithography for Fabrication of Complex Non-rectangular Channels

Song Gao,Tonghuan Zhan,Wei Zhou,Fuzhou Niu,Shuqiang Min,Aijun Xiao,Bing Xu

DOI: https://doi.org/10.1021/acsami.3c01306

IF: 9.5

2023-06-23

ACS Applied Materials & Interfaces

Abstract:This paper demonstrates a simple, flexible, and controllable technique to fabricate complex non-rectangular microchannels through the mold (e.g., balls) embossing-based soft lithography method. The good ductility of aluminum foil ensures the complete replication of the ball morphology, resulting in creation of the microchannels with a perfect circular cross section. By investigating the fabrication parameters such as the gap size and ball diameter, we can precisely control the width and height...

materials science, multidisciplinary,nanoscience & nanotechnology
Study on Polymer Flow Profile in Micro Hot Embossing

HE Yong,FU Jian-zhong,CHEN Zi-chen

DOI: https://doi.org/10.3321/j.issn:1004-924x.2008.02.015

2008-01-01

Optics and Precision Engineering

Abstract:To find the relationship between the mold structure and the flow profile,the Deform-2D code was used to simulate the micro hot embossing process.The effect of the mold duty ratio,Ratio Of the mold Width to the polymer Thickness(ROWT),concave mold,convex mold and the non-symmetric mold on the polymer flow profile was systematically studied.The numerical simulation results show that the flow profile of the polymer changes from single peak to dual peak,from craggedness to flatness with the decrease of the duty ratio.When ROWT is more than 1.5,the flow profile becomes dual peak.The simulation results are verified by the relative experiments.Compared with the results of nearly no pattern height difference when the convex mold is used,the micro pattern height has distinct difference when the concave mold is used.The strategy of topology optimization of mold structures was proposed to improve the polymer filling efficiency.With the help of some flow barriers located at the edge of the mold,the polymer flow speed at the boundary can decrease and the effective filling will be enhanced.The numerical simulation results show that this optimization strategy can accelerate the polymer filling speed in hot embossing.
Research on Optimization of the Hot Embossing Process

Yong He,Jian-Zhong Fu,Chen

DOI: https://doi.org/10.1088/0960-1317/17/12/005

2007-01-01

Journal of Micromechanics and Microengineering

Abstract:The hot embossing of polymer was studied to improve product quality. The finite element method (FEM) was used to analyze the embossing step, the cooling step and the demolding step with respect to product quality. The numerical simulation results show that profile precision is largely influenced by the topological structure of the mold during the embossing step. Inadequate holding time will result in low pattern fidelity. Inappropriate demolding temperature could induce a large thermal stress at the bottom of the micro pattern, while keeping imprint pressure during the cooling step will aggravate this phenomenon. Fracture, necking and pattern distortion can easily be induced by adhesion between the polymer and the mold when high aspect ratio patterns are demolded. The hot embossing process was optimized and an improved hot embossing system with an automatic demolding device was designed based on the simulation analysis. Successful fabrication of fine patterns with a high aspect ratio verified the improvements.
Fabrication of a Metal Micro Mold by Using Pulse Micro Electroforming

Xiaolei Chen,Li Liu,Junfeng He,Fei Zuo,Zhongning Guo

DOI: https://doi.org/10.3390/mi9050203

IF: 3.4

2018-04-27

Micromachines

Abstract:Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its unique characteristics, polymethyl methacrylate (PMMA) show great potential in fabricating microfluidic devices. Hot embossing technology has established itself as a popular method of preparing polymer microfluidic devices in both academia and industry. However, the fabrication of the mold used in hot embossing is time-consuming in general and often impractical for economically efficient prototyping. This paper proposes a modified technology for preparing metal micro molds by using pulse micro electroforming directly on metallic substrate, which could save time and reduce costs. In this method, an additive was used to avoid surface defect on deposited nickel. A chemical etching process was performed on the metallic substrate before the electroforming process in order to improve the bonding strength between the deposited structure and substrate. Finally, with the aim of obtaining a metal micro mold with high surface quality (low surface roughness), an orthogonal experiment was designed and conducted to optimize the electroforming parameters. Additionally, metal micro molds with different structures were well prepared by using the optimized parameters.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Formability improvement of hot embossing for functional micro-array structures with a novel exhaust punch

Xiaoliang Wang,Yongda Liu,Hongpeng Jiang,Jie Xu,Debin Shan,Bin Guo

DOI: https://doi.org/10.1016/j.jmrt.2023.10.020

IF: 6.267

2023-10-09

Journal of Materials Research and Technology

Abstract:Surface microstructures can endow materials with excellent functions such as enhanced heat transfer. However, with the continuous improvement of function enhancement, it is urgent to develop the manufacturing technology of more complex multiscale functional microstructures. Herein, an exhaust hot embossing based on a novel multi-block assembled punch is developed to fabricate micro-array structures, and the microformability of conventional process and exhaust process is compared. The combined processing technology of slow-feeding wire cut electrical discharge machining and micro electrical discharge machining is adopted to manufacturing the assembled exhaust punch with numerous micro-holes and complex multiscale features. The processing quality of the assembled punch is better than the integrated punch, and the surface roughness of each position of the assembled punch is Ra < 0.2 μm. During hot embossing experiments, it is found that the exhaust process could significantly improve the filling performance. At 300 o C, the exhaust process realizes complete filling of the microstructures under the maximum load of 25 kN, whereas the conventional process requires 50 kN. Meanwhile, it is also found that the exhaust process can significantly improve warping and surface coarsening defects compared to the conventional process. The pool boiling test was carried out on the fabricated micro-array structures, and it was found that its heat transfer performance is significantly enhanced compared with other tested surfaces, which will be applied in enhanced heat transfer.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Micro Etching Method Inside Microchannels

Yi Zheng,Haibo Xie,Xin Fu,Huayong Yang

2009-01-01

Abstract:Microfluidic devices basically operate at low Reynolds numbers, which leads entirely laminar features Of the fluid in microchannels. This paper presents a novel micro fabrication method based on the laminar characteristics of microscale flow. This new micro fabrication process can be used for high aspect ratio etching inside a micro channel on isotropic Substrate materials and the features of the micro structures, which are patterned with this fabrication method, are determined by the flow parameters. A new kind of Glass-PDMS microfluidic chip with an impermanent bonding is used for the convenience of observing and measurement. The effects of flowrates on etching rate and the micro topography were analyzed. The quantitative conclusion described in this letter, is required for understanding the features Of Surface chemical reaction inside microchannels.
Enhanced Polymer Filling and Uniform Shrinkage of Polymer and Mold in A Hot Embossing Process

Yong He,JianZhong Fu,Peng Zhao,Chen

DOI: https://doi.org/10.1002/pen.23379

2012-01-01

Abstract:Low filling efficiency and large thermal stress are two important problems that limit the wide use of hot embossing especially in fabricating high aspect ratio patterns. Two types of flow barriers, the first being an accessorial slot on the mold (SFB), the other was a block on the hot embossing machine (BFB), were designed to enhance polymer filling and their performances were simulated with the finite element method. The numerical simulation results show that two kinds of flow barriers can also accelerate the polymer filling speed and improve filling efficiency. The BFB has a better promoting effect and can be easily used as a quasi close-die embossing process. The shrinkage of the polymer and mold is made uniform with a designed polymer grip holder to minimize the thermal stress. The polymer was clipped at a temperature in a cooling step and its deformation was fixed; thus, the shrinkage of the polymer can be equal to the mold at a special temperature. An improved hot embossing machine was designed and the hot embossing process was modified to satisfy these requirements. At last successful fabrication of the light guide plate verified the improvements. POLYM. ENG. SCI., 2013. (c) 2012 Society of Plastics Engineers
Micro-Fabrication and Monitoring of Three-Dimensional Microstructures Based on Laser-Induced Thermoplastic Formation

Leyan Wang,Dongxian Zhang,Zhenghu Wen,Haijun Zhang

DOI: https://doi.org/10.1002/jemt.20722

2009-01-01

Microscopy Research and Technique

Abstract:This article reports a novel laser-induced micro-fabrication method and its monitoring system for three-dimensional (3D) microstructures. The mechanism of the method is that a small zone of thermoplastic material melted by laser heating grows in liquid surrounding environment, solidifying into a convex microstructure, such as micro-dot or micro-pillar. A laser diode (808 nm) with maximum power output of 130 mW is used as power source, and a kind of paraffin mixed with stearic acid and paint serves as the thermoplastic material for 3D microstructure formation experiments. A light microscope system consisting of a charge-coupled device (CCD) and a computer is utilized to realize real-time observation of the micro-fabricating process. The distribution of local temperature rise on material surface created by laser irradiation is simulated. The effects of liquid environment on microstructure formation have been theoretically analyzed and experimentally studied. Experiments are further carried out to investigate the relationship between laser spot and fabricated microstructures. The results indicate that the widths of microdots or micro-pillars are mostly determined by the size of focal spot, and their heights increase with the enlargement of laser power density. With this method, a micro-dot array of Chinese characters meaning "China" has been successfully fabricated through computer programming. This method has the advantages of implementing direct, mask-less, real-time and inexpensive 3D microstructure fabrication. Therefore, it would be widely applied in the fields of micro/nano-technology for practical fabrication of different kinds of 3D microstructures. Microsc. Res. Tech. 72:717-722, 2009. (C) 2009 Wiley-Liss, Inc.
Hot Embossing to Fabricate Parylene-Based Microstructures and Its Impact on the Material Properties

Florian Glauche,Franz Selbmann,Markus Guttmann,Marc Schneider,Stefan Hengsbach,Yvonne Joseph,Harald Kuhn

DOI: https://doi.org/10.3390/polym16152218

2024-08-03

Abstract:This study aims to establish and optimize a process for the fabrication of 3D microstructures of the biocompatible polymer Parylene C using hot embossing techniques. The different process parameters such as embossing temperature, embossing force, demolding temperature and speed, and the usage of a release agent were optimized, utilizing adhesive micropillars as a use case. To enhance compatibility with conventional semiconductor fabrication techniques, hot embossing of Parylene C was adapted from conventional stainless steel substrates to silicon chip platforms. Furthermore, this adaptation included an investigation of the effects of the hot embossing process on metal layers embedded in the Parylene C, ensuring compatibility with the ultra-thin Parylene printed circuit board (PCB) demonstrated previously. To evaluate the produced microstructures, a combination of characterization methods was employed, including light microscopy (LM) and scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and Fourier-transform infrared spectroscopy (FTIR). These methods provided comprehensive insights into the morphological, chemical, and structural properties of the embossed Parylene C. Considering the improved results compared to existing patterning techniques for Parylene C like plasma etching or laser ablation, the developed hot embossing approach yields a superior structural integrity, characterized by increased feature resolution and enhanced sidewall smoothness. These advancements render the method particularly suitable for diverse applications, including but not limited to, sensor optical components, adhesive interfaces for medical wearables, and microfluidic systems.
Studies of Polymer Deformation and Recovery in Hot Embossing

X. C. Shan,Y. C. Liu,H. J. Lu,Z. F. Wang,Y. C. Lam

DOI: https://doi.org/10.48550/arXiv.0802.3106

2008-02-21

Abstract:In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness of embossed devices. This paper reports on experimental studies of polymer deformation and relaxation in micro embossing when the process temperatures are below or near its glass transition temperature (Tg). In this investigation, an indentation system and a micro embosser were used to investigate the relationship of microstructure formation versus process temperature and load pressure. The depth of indentation was controlled and the load force at a certain indentation depth was measured. Experiments were carried out using 1 mm thick PMMA films with the process temperature ranging from Tg-55 degrees C to Tg +20 degrees C. The embossed structures included a single micro cavity and groups of micro cavity arrays. It was found that at temperature of Tg-55 degrees C, elastic deformation dominated the formation of microstructures and significant relaxation happened after embossing. From Tg-20 degrees C to Tg, plastic deformation dominated polymer deformation, and permanent cavities could be formed on PMMA substrates without obvious relaxation. However, the formation of protrusive structures as micro pillars was not complete since there was little polymer flow. With an increase in process temperature, microstructure could be formed under lower loading pressure. Considering the fidelity of a single microstructure and global flatness of embossed substrates, micro hot embossing at a low process temperature, but with good fidelity, should be preferred.

Other Computer Science
Simulation Research on Stress of Polymeric Patterns During Micro Hot Embossing

Ting Zhang,Yong He,Jianzhong Fu

DOI: https://doi.org/10.4028/www.scientific.net/amm.80-81.339

2011-01-01

Applied Mechanics and Materials

Abstract:The properties of polymeric components made by hot embossing are obviously affected by the geometry of the mold such as the duty ratio, the aspect ratio, width to thickness ratio and the mold cavity position. This paper focuses on numerical simulations with isothermal embossing conditions in order to observe the stress distribution and the stress concentration of the polymeric patterns. The simulation results show that stress concentration in the PM:MA resist accumulates at the contact corner between the mold and the polymer, and the location of the stress distribution is mainly on the profile of the replicated patterns. Small duty ratio will result in high stress concentration at the corner of the replicated components. The stress concentration also increases rapidly while the aspect ratio of the mold increases. The thicker the polymer is, the more difficult the adequate flow of the polymer becomes, and the stress concentration rises up. A stress barrier can be used in the mold in order to reduce the stress concentration in the middle of the replicated polymeric patterns.
Mass copper micro-embossing by tungsten die for MEMS applications

Xuanyang Li,Jian Liu,Jie Xu,Zetian Wang,Jing Chen

DOI: https://doi.org/10.1088/1361-6439/aae2c0

2018-01-01

Journal of Micromechanics and Microengineering

Abstract:The copper micro-embossing process using tungsten die was investigated in this paper, which can be applied for mass production on micro-electro-mechanical system (MEMS) components. Tungsten die fabricated by inductively coupled plasma etching was applied, because of its high mechanical strength and high accuracy. Both cold and hot micro-embossing were performed. Micro damage of both copper and tungsten was observed in cold micro-embossing, as the pressing force reached up to 10kN. Hot micro-embossing under 473 K with a pressing force of 6kN showed fewer micro-defects without damage. The microchannels with smaller space ratios and channel widths had better filling performances, due to their capability against friction or upsetting. The patterns were fully transferred from the tungsten die to copper workpiece with a minimum linewidth of 20 mu m and aspect ratio of up to 1.09. The fabrication method shows the potential for copper MEMS component fabrication in mass production at low-cost.

Micro Structure Fabrication with a Simplified Hot Embossing Method

Experimental Study on the Hot Embossing Polymer Microfluidic Chip

Experimental Study on the Fabrication of the Light Guide Plate with Hot Embossing Method

Three Dimension Micro-structure Soft Lithography Technology

Research on Heat Transfer for Hot Embossing of Polymeric Microfluidic Chips

Flow Behavior of Polymer During Micro Hot Embossing

Defects in Micro Hot Embossing Process

Optimization of Control Parameters in Micro Hot Embossing

A facile and low-cost micro fabrication material: flash foam

Mold Embossing - Based Soft Lithography for Fabrication of Complex Non-rectangular Channels

Study on Polymer Flow Profile in Micro Hot Embossing

Research on Optimization of the Hot Embossing Process

Fabrication of a Metal Micro Mold by Using Pulse Micro Electroforming

Formability improvement of hot embossing for functional micro-array structures with a novel exhaust punch

Micro Etching Method Inside Microchannels

Enhanced Polymer Filling and Uniform Shrinkage of Polymer and Mold in A Hot Embossing Process

Micro-Fabrication and Monitoring of Three-Dimensional Microstructures Based on Laser-Induced Thermoplastic Formation

Hot Embossing to Fabricate Parylene-Based Microstructures and Its Impact on the Material Properties

Studies of Polymer Deformation and Recovery in Hot Embossing

Simulation Research on Stress of Polymeric Patterns During Micro Hot Embossing

Mass copper micro-embossing by tungsten die for MEMS applications