Analysis of Heat Transfer Performance about Microchannel Heat Sinks Using FEM

yang chaochu,bi qincheng,chen tingkuan,dong tao
DOI: https://doi.org/10.3321/j.issn:1004-132X.2003.21.020
2003-01-01
Abstract:Galerkin finite element formulation has been applied to predict the surface temperature, fluid temperature and the total resistance of the microchannel heat sinks for electronic chips cooling. Compared with other corresponding methods, the finite element method designed in the paper can be used in analyzing the heat transfer characteristics in microchannel heat sinks with discretional bottom heat flux distribution.This method has wider applications than that of massive CFD(computational fluid dynamics) calculations. The FEM procedure is also a useful tool for analyzing the effect of geometrical parameters on the performance of the microchannel heat sinks.
What problem does this paper attempt to address?