Abstract:Micro-channel cooler is a very promising approach to meet the requirements of microelectronics package cooling. A lot of investigations about micro-channels have been undertaken in the past years. A silicon micro-channel can remove 790W/cm2 heat with a temperature rise of 71 degrees between the substrate and the coolant. The width and height of the silicon channel are 50um and 302um separately [1]. However, as the trends in the electronics industry moves towards higher packaging density, the high-pressure drop problem limits the performance of traditional silicon heat sink. Replacing the silicon fins with nanotube fins to enhance the thermal exchange rate between cooling liquid and substrate is one way to overcome this problem. Growing aligned nanotubes on the whole substrate is another one [2]. Carbon nanotubes (CNTs) are a new form of carbon which was discovered in 1991 by Iijima [3]. CNTs can be grown directly on the surface of silicon accurately according to predefined small-scale catalyst patterns normally transferred by standard photolithography processes. It was reported that nanotubes have an extremely high thermal conductivity over 3000W/(km) [4], so in the present work, the thermo physical properties of CNTs are obtained via molecular dynamics (MD) method. Fig. 1 shows one single-wall CNT simulation by LAMMPS. Several CNTs-fin heat sinks (1cm*1cm) with different fin width varied from 2um to 200um are tested (Fig. 2). Then the aligned CNTs heat sink is also simulated to compare with the long CNTs-fin model. The heat transfer coefficients and pressure drop of these structures are computed. Results indicate replacing the silicon-fin with CNTs-fin is a promising method and the long CNT-fin model shows better performance than the aligned CNTs for generating little pressure drop. Among the models, the best one is chosen for experiments in next work.

A study of the heat transfer characteristics of the micro-channel heat sink

Numerical Study on Performances of Mini-Channel Heat Sinks with Non-Uniform Inlets

Package heat dissipation with integrated carbon nanotube micro heat sink

Numerical Investigation of Fluid Flow and Heat Transfer in High-Temperature Wavy Microchannels with Different Shaped Fins Cooled by Liquid Metal

Numerical study of different micro-channel structures on fluid flow and heat transfer performance

Analysis of Heat Transfer Enhancement in a Micro-Scale Heat Sink Structure

Experimental and numerical investigation on the heat transfer enhancement for Mini-channel heat sinks with tessellated fins

Numerical study on heat transfer and flow characteristics of novel microchannel heat sinks

Comparative studies on heat transfer and flow resistance of nanofluid in microchannels with different sidewall micro-fins

Numerical Study on Heat Transfer Efficiency and Inter-Layer Stress of Microchannel Heat Sinks with Different Geometries

Heat Transfer Enhancement of Microchannel Heat Sink Using Sine Curve Fins

Numerical Study of Enhanced Heat Transfer of MicroChannel Heat Sink with Nanofluids

Micro-Channel Heat Sink: A Review

Study on the performance of a miniscale channel heat sink with Y-shaped unit channels based on entransy analysis

Comparison of cooling performance of nanofluid flows in mini/micro-channel stacked double-layer heat sink and single-layer micro-channel heat sink

Research on the mechanism of heat transfer enhancement in microchannel heat sinks with micropin fins

Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks

Numerical investigations of heat transfer augmentation in a microchannel heat sink with different shaped periodic reentrant cavities on channel sidewalls

Heat transfer enhancement using combined microchannel with vertical rectangular micro fins

Numerical simulation study of thermal and hydraulic characteristics of laminar flow in microchannel heat sink with water droplet cavities and different rib columns

Heat transfer optimization based on finned microchannel heat sink