Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn- x Ag/Cu Joints

M. L. Huang,Y. Z. Huang,H. T. Ma,J. Zhao
DOI: https://doi.org/10.1007/s11664-010-1459-y
IF: 2.1
2010-01-01
Journal of Electronic Materials
Abstract:The effect of Ag content on the wetting behavior of Sn-9Zn- x Ag on aluminum and copper substrates during soldering, as well as the mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn- x Ag/Cu solder joints, were investigated in the present work. Tiny Zn and coarsened dendritic AgZn 3 regions were distributed in the Sn matrix in the bulk Sn-9Zn- x Ag solders, and the amount of Zn decreased while that of AgZn 3 increased with increasing Ag content. The wettability of Sn-9Zn-1.5Ag solder on Cu substrate was better than those of the other Sn-9Zn- x Ag solders but worse than that of Sn-9Zn solder. The wettability of Sn-9Zn-1.5Ag on the Al substrate was also better than those of the other Sn-9Zn- x Ag solders, and even better than that of Sn-9Zn solder. The Al/Sn-9Zn/Cu joint had the highest shear strength, and the shear strength of the Al/Sn-9Zn- x Ag/Cu ( x = 0 wt.% to 3 wt.%) joints gradually decreased with increasing Ag content. The corrosion resistance of the Sn-9Zn- x Ag solders in Al/Sn-9Zn- x Ag/Cu joints in 5% NaCl solution was improved compared with that of Sn-9Zn. The corrosion potential of Sn-9Zn- x Ag solders continuously increased with increasing Ag content from 0 wt.% to 2 wt.% but then decreased for Sn-9Zn-3Ag. The addition of Ag resulted in the formation of the AgZn 3 phase and in a reduction of the amount of the eutectic Zn phase in the solder matrix; therefore, the corrosion resistance of the Al/Sn-9Zn- x Ag/Cu joints was improved.
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