Electrochemical Behavior of Zn-xSn High-Temperature Solder Alloys in 0.5 M NaCl Solution

Zhenghong Wang,Chuantong Chen,Jinting Jiu,Shijo Nagao,Masaya Nogi,Hirotaka Koga,Hao Zhang,Gong Zhang,Katsuaki Suganuma

DOI: https://doi.org/10.1016/j.jallcom.2017.04.281

IF: 6.2

2017-01-01

Journal of Alloys and Compounds

Abstract:Electrochemical behavior of Zn-xSn (x = 40 wt%, 30 wt%, 20 wt%) high-temperature lead-free alloys was investigated in aerated 0.5 M NaCl solution by open circuit potential (OCP), electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization techniques. OCP results show that the corrosion state of the alloys working surface reached a relatively dynamic equilibrium after the alloys were immersed in 0.5 M NaCl solution for 100 h. EIS analysis reveals that the total corrosion resistance R-t of alloys depended on the amount of Sn, and Zn-40Sn possessed the highest value 2228.2 Omega cm(2). No passivation behavior was observed during corrosion process by potentiodynamic polarization measurement. The dominant corrosion products were confirmed as Zn-5(OH)(8)Cl-2 center dot H2O, ZnO and Zn(OH)(2). Moreover, the surface and cross-section morphology of corrosion product suggested that the corrosion layer was more homogeneous and denser for higher Sn-content, Zn-40Sn obtained the best protective layer from corrosion product. The results recommend that Zn-xSn high-temperature solder alloy with higher Sn content appears to be more attractive in terms of superior corrosion properties. The exact corrosion process was also discussed in detail. (C) 2017 Elsevier B. V. All rights reserved.