Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions
Rui Li,Sen Cong,Jiancheng Mei,Le Zhang,Zhuo Chen,Ting Li,Xinjian Yuan
DOI: https://doi.org/10.1016/j.jmrt.2020.12.076
IF: 6.267
2021-01-01
Journal of Materials Research and Technology
Abstract:<p>Electronic packaging products are often subjected to reliability evaluation, Sn–Pb solder is widely used in high-reliability military products due to its excellent soldering performance. Sn–36Pb–2Ag eutectic solder joints were subjected to aging experiments at 75 °C, 100 °C, 125 °C, and 150 °C for 100 h, 250 h, 500 h, and 1000 h, respectively. Continuous Cu<sub>3</sub>Sn and (Au, Cu)<sub>6</sub>Sn<sub>5</sub> compounds were formed on the printed circuit board (PCB) substrate side after aging experiments, and continuous (Au, Ni)Sn<sub>4</sub> and (Au, Ni)<sub>3</sub>Sn<sub>4</sub> compounds were formed on the electronic component side. In addition, the Pb–rich phase on the IMC layer side increased with the increase in aging time and aging temperature. Thus, the mechanical properties of the solder joints seriously reduced, and the push force of the fractured solder joint measured in the push–pull force experiment was reduced from approximately 85 N (125 °C–500 h) to approximately 42 N (150 °C–1000 h). The fracture mode of solder joint under 150 °C–1000 h aging conditions was brittle. Furthermore, the diffusion coefficient and activation energy of the Cu<sub>3</sub>Sn phase and (Au, Cu)<sub>6</sub>Sn<sub>5</sub> phase on the PCB substrate side were calculated.</p>
materials science, multidisciplinary,metallurgy & metallurgical engineering