On formation of intermetallic compounds at the Copper /Niobium-Titanium interface
Viktor Karpati,Jozsef Korozs,George Kaptay,Valeria Mertinger
DOI: https://doi.org/10.1016/j.jallcom.2022.165567
IF: 6.2
2022-10-15
Journal of Alloys and Compounds
Abstract:Temperature dependence of the formation of harmful, very brittle Cu-Ti intermetallic phases at the Cu/Nb-Ti interface was studied by annealing the samples for 2 h. Lamellar structured Cu/Nb-Ti diffusion couples were created and subjected to hot upsetting at 300 °C, 400 °C, 500 °C, 600 °C, 700 °C, 800 °C, 825 °C, 850 °C, 875 °C and 900 °C. It was found that at and below 800 °C, the Cu/Nb-Ti interface is free of intermetallic compounds, at least with a micron resolution. However, at 825 °C, the first intermetallic phases are formed with a thickness above 1 μm, partly covering the original Cu/Nb-Ti interface. It is shown that the thickness and amount of intermetallic phases rapidly increase with increasing temperature. From extrapolating the measured thickness–temperature data to zero thickness, it was found that the intermetallics appear with a size of at least a micron at about 820 °C within 2 h of holding time. However, diffusional calculations provided a much lower thickness than expected. Thermodynamic calculations show that the first liquid phase appears in the ternary Cu-Nb-Ti system at about 819 °C. Above this temperature, a catastrophic formation of intermetallics is expected. This result agrees with the 820 °C value found empirically as the starting temperature of micron-sized intermetallic formation.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering