Demonstrate High R-OFF/R-ON Ratio and Forming-Free RRAM for Rfpga Application Based on Switching Layer Engineering

Wenfeng Dong,Dong Liu,Shun Xu,Bing Chen,Yi Zhao
DOI: https://doi.org/10.1109/asicon.2017.8252610
2017-01-01
Abstract:The application of reconfigurable architectures in field programmable gate array (FPGA) has been addressed great concern by academic and industrial. However, fabricating a nonvolatile device for circuit routing configuration in connection block is still a great challenge. In this paper, a forming-free RRAM technology with high resistance R ON /R OFF ratio (∼10 6 ) is developed for reconfigurable circuits connecting. The demonstrated RRAM with switching layer engineered Pd/Al 2 O 3 /HfO 2 /NiO x /Ni structure shows excellent performance, such as low variation, good retention (>10 years@85°C) and large drive current (>1mA). In addition, corresponding switching mechanism and how to improve RRAM's resistance R ON /R OFF ratio by material engineering and device structure optimization are also discussed.
What problem does this paper attempt to address?