Passivation Effect of Atomic Layer Deposition of Al 2 O 3 Film on HgCdTe Infrared Detectors

Peng Zhang,Zhen-Hua Ye,Chang-Hong Sun,Yi-Yu Chen,Tian-Ning Zhang,Xin Chen,Chun Lin,Ring-Jun Ding,Li He
DOI: https://doi.org/10.1007/s11664-016-4686-z
IF: 2.1
2016-01-01
Journal of Electronic Materials
Abstract:The passivation effect of atomic layer deposition of (ALD) Al 2 O 3 film on a HgCdTe infrared detector was investigated in this work. The passivation effect of Al 2 O 3 film was evaluated by measuring the minority carrier lifetime, capacitance versus voltage ( C – V ) characteristics of metal–insulator–semiconductor devices, and resistance versus voltage ( R – V ) characteristics of variable-area photodiodes. The minority carrier lifetime, C – V characteristics, and R – V characteristics of HgCdTe devices passivated by ALD Al 2 O 3 film was comparable to those of HgCdTe devices passivated by e-beam evaporation of ZnS/CdTe film. However, the baking stability of devices passivated by Al 2 O 3 film is inferior to that of devices passivated by ZnS/CdTe film. In future work, by optimizing the ALD Al 2 O 3 film growing process and annealing conditions, it may be feasible to achieve both excellent electrical properties and good baking stability.
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