Low-temperature Solution-Processed Alumina Dielectric Films for Low-Voltage Organic Thin Film Transistors

Lishu Zhang,Qian Zhang,Guodong Xia,Ji Zhou,Sumei Wang
DOI: https://doi.org/10.1007/s10854-015-3264-0
2015-01-01
Journal of Materials Science Materials in Electronics
Abstract:We studied low-temperature alumina (AlOx) gate dielectrics by a simple spin-coating of home-made aluminum acetate hydroxide precursor (Al(OH)(C2H3O2)2) for low-voltage organic thin-film transistors (OTFTs). To improve the inorganic/organic interface, a thin PS polymer was introduced as interface modifier layer. Low leakage current of 7 × 10−6 A/cm2 and high dielectric constant of 5.8 were achieved for AlOx dielectrics at the low temperature of 200 °C. The OTFT with 200 °C annealed AlOx dielectrics can operate at the low voltage of 5 V. Moreover, the OTFT with 200 °C annealed AlOx film realized a high charge carrier mobility of 0.46 cm2/Vs and high on/off ratio of 1.04 × 104, comparable to the mobility of 0.51 cm2/Vs and on/off ratio of 2.53 × 104 for OTFT with 400 °C annealed AlOx film. Our results suggested that simple low-temperature annealing can offer high-performance dielectric films for OTFTs, providing a promising approach for low-power organic electronics at a low cost.
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