Wide process temperature of atomic layer deposition for In 2 O 3 thin-film transistors using novel indium precursor (N,N'-di-tert butylacetimidamido)dimethyllindium)

Juhun Lee,Seung Youl Kang,Changbong Yeon,Jong-Heon Yang,Jaesun Jung,Kok Chew Tan,Kitae Kim,Yeonjin Yi,Soohyung Park,Chi-Sun Hwang,Jaehyun Moon
DOI: https://doi.org/10.1088/1361-6528/ad5848
IF: 3.5
2024-06-16
Nanotechnology
Abstract:This study introduces a novel heteroleptic indium complex that includes an amidinate ligand as a high-temperature atomic layer deposition (ALD) precursor. The most stable structure was deduced using density functional theory and was synthesized and exhibited thermal stability up to 375 oC. We fabricated the indium oxide thin-film transistors (In2O3 TFTs) prepared by DBADMI precursor using ALD at the wide widow process temperature 200 oC, 300 oC, and 350 oC with ozone (O3) source. The growth per cycle (GPC) of ALD was found from 0.06 to 0.1 nm/cycle at various deposition temperatures. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were performed to analyze the crystalline structure as a function of deposition temperature, and at a relatively low deposition temperature of 200 oC, an amorphous morphology was observed, while at 300 and 350 oC. In addition, x-ray photoelectron spectroscopy (XPS) analysis was performed to identify the In-O and OH-related in the film, and the OH-related was found to be as low as 1 % with increasing deposition temperature. Furthermore, we proceeded to the In2O3 TFT and found that the field effect mobility increased and the Vth value changed little at 200, 300, and 350 oC. As a result, the high deposition temperature stable DBADMI precursor is ideal for producing good films and stable crystalline phases, and its wide process temperature range makes it suitable for a variety of applications.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
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