Abstract:Thermal issues are a primary concern in the three-dimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized during 3D floorplanning, significantly increasing optimization complexity. Most existing floorplanners use combinatorial stochastic optimization techniques, hampering performance and scalability when used for 3D floorplanning. In this work, we propose and evaluate a scalable, temperature-aware, force-directed fioorplanner called 3D-STAF. Force-directed techniques, although efficient at reacting to physical information such as temperature gradients, must eventually eliminate overlap. This can cause significant displacement when used for heterogeneous blocks. To smooth the transition from an unconstrained 3D placement to a legalized, layer-assigned floorplan, we propose a three-stage force-directed optimization flow combined with new legalization techniques that eliminate white spaces and block overlapping during multi-layer floorplanning. A temperature-dependent leakage model is used within 3D-STAF to permit optimization based on the feedback loop connecting thermal profile and leakage power consumption. 3D-STAF has good performance that scales well for large problem instances. Compared to recently published 3D floorplanning work, 3D-STAF improves the area by 6%, wire length by 16%, via count by 22%, peak temperature by 6% while running nearly 4times faster on average.

Combining the Ant System Algorithm and Simulated Annealing for 3d/2d Fixed-Outline Floorplanning

Multi-Objective Optimization in 3D Floorplanning

A thermal-driven force-directed floorplanning algorithm for 3D ICs

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

GoodFloorplan: Graph Convolutional Network and Reinforcement Learning-Based Floorplanning

Floorplanning For 2.5-D System Integration Using Multi-Layer-Bsg Structure

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

A Floorplanning Algorithm for Novel Three-Dimensional Nano Integrated Circuits

Multi-objective optimization in fixed-outline floorplanning with reinforcement learning

A Fixed-Outline Floorplanning Method Based On 2.5d

On Handling Fixed Blocks in Incremental Fixed-Outline Floorplanning

A Novel Fixed-Outline Floorplanner with Zero Deadspace for Hierarchical Design

An Efficient Algorithm to Fixed-Outline Floorplanning Based on Instance Augmentation

Fixed-Outline Floorplanning with Constraints Through Instance Augmentation

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Integrated Interlayer Via Planning And Pin Assignment For 3d Ics

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

A Floorplanning Algorithm for Block Placement in SoC Design

Floorplanning of VLSI by Mixed-Variable Optimization

Cubic Packing with Various Candidates for 3D IC Design

Fixed-Outline Floorplanning Based on Common Sub-sequence