High quality crack-free GaN film grown on si (111) substrate without AlN interlayer

danwei li,jiasheng diao,xiangjing zhuo,jun zhang,xingfu wang,chao liu,bijun zhao,kai li,lei yu,yuanwen zhang,miao he,shuti li
DOI: https://doi.org/10.1016/j.jcrysgro.2014.08.025
IF: 1.8
2014-01-01
Journal of Crystal Growth
Abstract:High quality crack-free GaN film has been grown on 2in. n-type Si (111) substrate without AlN interlayers by metalorganic chemical vapor deposition (MOCVD). By using a two-step-pressure growth technique for the AlN buffer layer, we have obtained crack-free 1.8μm thick continuous GaN layer. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) results indicate that the two-step-pressure growth method can improve the crystalline quality of the GaN film by prolonging the three-dimensional (3D) growth process of the GaN layer, Raman spectrum analysis shows that tensile stress in the overlaying GaN layer can be reduced obviously to 0.62GPa, which helps to reduce the possibility of cracking.
What problem does this paper attempt to address?