Abstract:Silicon oxynitride (SiON) is an important material to fabricate micro-electro-mechanical system (MEMS) devices due to its composition-dependent tunability in electronic and mechanical properties. In this work, the SiON film with 41.45% silicon, 32.77% oxygen and 25.78% nitrogen content was deposited by RF magnetron sputtering. Two types of optimized micro-structures including micro-cantilevers and micro-rotating-fingers were designed and fabricated using MEMS surface micromachining technology. The micro-cantilever bending tests were conducted using a nanoindenter to characterize the Young's modulus of the SiON film. Owing to the elimination of the residual stress effect on the micro-cantilever structure, higher accuracy in the Young's modulus was achieved from this technique. With the information of Young's modulus of the film, the residual stresses were characterized from the deflection of the micro-rotating-fingers. This structure was able to locally measure a large range of tensile or compressive residual stresses in a thin film with sufficient sensitivities. The results showed that the Young's modulus of the SiON film was 122GPa and the residual stresses of the SiON film were 327MPa in the crystallographic orientation of the wafer and 334MPa in the direction perpendicular to the crystallographic orientation, both in compression. This work presents a comprehensive methodology to measure the Young's modulus and residual stresses of a thin film with improved accuracy, which is promising for applications in mechanical characterization of MEMS devices.

Measurements of Young’s Modulus of Silicon Oxynitride Using Micro-Cantilever Structure

Characterization of the Young's Modulus and Residual Stresses for a Sputtered Silicon Oxynitride Film Using Micro-Structures

Young's Modulus Measurement of Nickel Silicide Film on Crystal Silicon by a Surface Profiler

Young's Modulus Characterization of Nano-Level Silicon Nanomembrane

Measurement of Young's modulus and residual stress of silicon microstructures

Reduction in Modulus of Suspended Sub-2 nm Single Crystalline Silicon Nanomembranes

Young’s Modulus Measurements of SiC Coatings on Spherical Particles by Using Nanoindentation

Effect of Different Oxide Thickness on the Bending Young'S Modulus of Sio2@Sic Nanowires

Young's Modulus of Nano Polycrystalline Silicon Film

Mechanical Properties of Mono-crystalline Silicon Thin Films Measured by Different Methods

Measurement and Analysis on Young's Modulus of Silicon Super Thin Free-Handing Diaphragm

Deposition of SiOxNy films as gate insulator via r.f. reactive sputtering

Mems/Nems Mechanical Characterization on Different Thin - Film Materials by Scanning along Micro-Machined Cantilevers

Measurement and Analysis on the Mechanical Properties of Silicon Carbide Film

Mechanical characterization of biocompatible thin film materials by scanning along micro-machined cantilevers for micro-/nano-system

The Young'S Modulus of High-Aspect-Ratio Carbon/Carbon Nanotube Composite Microcantilevers by Experimental and Modeling Validation

Study of the Bending Modulus of Individual Silicon Nitride Nanobelts Via Atomic Force Microscopy

A nanoindentation-based microbridge testing method for mechanical characterization of thin films for MEMS applications

Online Test Structure for Measuring Young'S Modulus and Residual Stress of the Top Silicon Layer of Silicon-On-Insulator by A Pull-In Approach

Measurements Of Microstructural, Chemical, Optical, And Electrical Properties Of Silicon-Oxygen-Nitrogen Films Prepared By Plasma-Enhanced Atomic Layer Deposition

Mechanical Properties of Silicon Carbonitride Thin Films