Development and Application of Electromagnetic Module in Multi-Fields Automatic Simulation Platform for Integrated Circuit Devices

ruo fan zhang,ke zhang,ren cheng wang,jia cheng,y j lu
DOI: https://doi.org/10.4028/www.scientific.net/AMM.722.194
2014-01-01
Applied Mechanics and Materials
Abstract:According to integrated circuit (IC) devices, this study proposed a integrated automatic design platform including geometric modeling, finite element simulation analysis, experimental design etc. The platform is a software system, the development of which is driven by product design of IC device chambers. As a module of the platform, the electromagnetic fields simulation part is based on secondary development of Ansys HFSS and the Python language to transfer data, build model and analyze automatically. The validity of the electromagnetic simulation module is verified by an example of PECVD SC300 chamber.
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