Increasing the cooling rate of Cu mold by liquid alloy coating

xiaoyang chen,yanliang ji,shuguang zhang,jianguo li
DOI: https://doi.org/10.1016/j.matlet.2015.03.010
IF: 3
2015-01-01
Materials Letters
Abstract:Cu mold casting is a common technique of rapid solidification, by which bulk materials (>1mm) can be produced with a cooling rate of 1~1000K/s. In this work, an improved Cu mold casting method with higher cooling rate is proposed. A thin layer of Ga–In–Sn liquid alloy is painted on the surface of Cu mold as a channel of heat flowing between cast sample and mold. The recorded cooling rate of the improved Cu mold exceeds the upper limit of cooling rate of Cu mold and reaches up to 1613K/s. Accordingly, refined microstructure and even a metallic glass layer at surface are obtained in the cast sample via the new method.
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