Abstract:Silicon carbide (SiC) ceramic material has become the most promising third-generation semiconductor material for its excellent mechanical properties at room temperature and high temperature. However, SiC ceramic machining has serious tool wear, low machining efficiency, poor machining quality and other disadvantages due to its high hardness and high wear resistance, which limits the promotion and application of such materials. In this paper, comparison experiments of longitudinal torsional ultrasonic vibration grinding (LTUVG) and common grinding (CG) of SiC ceramics were conducted, and the longitudinal torsional ultrasonic vibration grinding SiC ceramics cutting force model was developed. In addition, the effects of ultrasonic machining parameters on cutting forces, machining quality and subsurface cracking were investigated, and the main factors and optimal parameters affecting the cutting force improvement rate were obtained by orthogonal tests. The results showed that the maximum improvement of cutting force, surface roughness and subsurface crack fracture depth by longitudinal torsional ultrasonic vibrations were 82.59%, 22.78% and 30.75%, respectively. A longitudinal torsional ultrasonic vibrations cutting force prediction model containing the parameters of tool, material properties and ultrasound was established by the removal characteristics of SiC ceramic material, ultrasonic grinding principle and brittle fracture theory. And the predicted results were in good agreement with the experimental results, and the maximum error was less than 15%. The optimum process parameters for cutting force reduction were a spindle speed of 22,000 rpm, a feed rate of 600 mm/min and a depth of cut of 0.011 mm.

Experimental Investigation on Conventional Grinding of TC4 and TC11 Using SiC Abrasive

Experimental Investigation on Conventional Grinding of Ti-6Al-4V Using SiC Abrasive

Investigation of Surface Integrity in Conventional Grinding of Ti-6Al-4V

Study on grinding machinability of titanium alloy using SiC abrasive

Surface Characteristics and Roughness Prediction of TC4 Titanium Alloy in High Speed Grinding

Experimental investigation on grinding-induced surface damage of Fiber Reinforced Ceramic Matrix Composites

Experimental Research of Grinding TC4 Titanium Alloy Using Green Silicon Carbide Wheel

Experimental Investigation on Materials Removal Mechanism During Grinding Silicon Carbide Ceramics with Single Diamond Grain

Study on Removal Mechanism and Surface Quality of SiCf/SiC Composites by Longitudinal Torsional Ultrasonic Vibration-Assisted Grinding

Experimental Study of Machinability in Mill-Grinding of SiCp/Al Composites

Wear-induced variation of surface roughness in grinding 2.5D C f /SiC composites

The Influence of Grain Geometry and Wear Conditions on the Material Removal Mechanism in Silicon Carbide Grinding with Single Grain

Mechanisms of abrasive wear in the grinding of titanium (TC4) and nickel (K417) alloys

Experimental study on grinding 2.5D C/SiC composites by electroplated grinding wheel with ordered abrasive clusters

Experimental study on mill-grinding SiCp/Al

Study on micro-grinding mechanism and surface quality of hardened 20 vol% SiCp/Al composites

Surface Grinding of C/C Composite Material

Numerical Investigation on the Influence of Cutting-Edge Radius and Grinding Wheel Speed on Chip Formation in SiC Grinding

Investigation of the Machined Surface Integrity of WC-High-Entropy Alloy Cemented Carbide

Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations

Grinding Characteristics and Surface Roughness Modeling of 2.5D Woven SiCf/SiC Ceramic Matrix Composites