Temperature Field Simulation of Electron Beam Cladding W Coating on Cu Substrate

Li Wan,Yi Ping Huang,Rui Bin Zhang,Hai Hua Yu,Hang Li,Jun Wei Duan,Hai Lang Liu
DOI: https://doi.org/10.4028/www.scientific.net/amr.1094.331
2015-01-01
Advanced Materials Research
Abstract:A 3D Finite Element Model of the Temperature Field for Electron Beam Cladding of Pre-Tungsten Powder on the Surface of the Copper Block was Established, According to the Actual Situation of the Electron Beam Cladding Process, Based on Finite Element Analysis Software ANSYS Workbench, Analyzed the Temperature Field Distribution of the Electron Beam Cladding Process. Temperature Field Calculation Results Showed that the Cladding Process Heating and Cooling Speed was up to 103-104°C/s, and the Surface Temperature Increased Rapidly, while the Temperature of the Substrate Maintained Low, since the Water Cooling System.
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