Temperature field simulation and solidification structure during laser hot wire cladding process

Wen-Quan Li,Peng-Wei Liu,Xin-Gang Liu,Ying-Jie Zhao,Motomichi Yamamoto,Song Zhu,Kenjiro Sugio,Sasaki,Gen Sasaki
DOI: https://doi.org/10.1088/1742-6596/2321/1/012015
2022-08-11
Journal of Physics: Conference Series
Abstract:In this study, a heat source model designed explicitly for rectangular laser heat sources was developed to simulate the temperature field during the laser hot wire cladding process. The influence of the temperature field on the solidified microstructure was investigated. The difference in morphology and size of solidified microstructure was mainly caused by temperature gradient and cooling rate. The grain morphology in the edge region was mainly columnar crystal with small size. The grain morphology in the central area was mainly equiaxed crystals with the larger size. This study provided a reference for understanding the characteristics of the solidification microstructure and its formation during laser hot wire cladding process.
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