The Influence of TiB2 Content on Microstructure and Properties of W–30Cu Composites Prepared by Electroless Plating and Powder Metallurgy

Li-Mei Huang,Lai-Ma Luo,Ji-Gui Cheng,Xiao-Yong Zhu,Yu-Cheng Wu
DOI: https://doi.org/10.1016/j.apt.2015.04.015
IF: 4.969
2015-01-01
Advanced Powder Technology
Abstract:W-30Cu composite materials with different concentrations of TiB2 particles ranging from 0 to 2 wt.% were prepared by electroless plating with simplified pretreatment and powder metallurgy. The morphologies of W-30Cu composite powders, original TiB2 powders, W-30Cu/TiB2 composite powders were characterized using field emission scanning electron microscopy. X-ray diffraction analysis was used to characterize the phase of W-30Cu/TiB2 composite powders. Relative density, electrical conductivity, and hardness of the W-30Cu/TiB2 composites were examined. Results showed that uniform Cu-coated W composite powders were successfully synthesized by electroless plating with simplified pretreatment. The addition of TiB2 nanoparticles significantly affected the microstructure and properties of W-Cu composite materials. A good combination of the relative density, electrical conductivity, and hardness of the W-30Cu composite materials can be obtained with the incorporation of TiB2 additive at 0.25 wt.%. (C) 2015 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.
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