Comprehensive Study of Thermal Transport and Coherent Acoustic-Phonon Wave Propagation in Thin Metal Film–Substrate by Applying Picosecond Laser Pump–Probe Method

weigang ma,tingting miao,xing zhang,masamichi kohno,yasuyuki takata
DOI: https://doi.org/10.1021/jp512735k
2015-01-01
Abstract:Three-dimensional integration with through silicon vias offers a promising solution for future technology nodes. However, the heat accumulation and thermal strain may seriously affect performance, leakage, and reliability of circuits. The cross-plane thermal transport, generation, and propagation of coherent acoustic-phonon wave in thin Pt film-glass substrate have been comprehensively studied by applying the picosecond laser pump-probe method with different configurations. Significantly different time-dependent reflectance signals have been obtained in different configurations and an effect superposition model is proposed to account for cross plane thermal transport inducing ipsi- and contralateral temperature change in thin Pt film, propagation of coherent acoustic-phonon wave in thin Pt film and in glass substrate. The corresponding theoretical predictions match well with the experimental data in the whole delay time range.
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