Abstract:The current research was focused on the mechanism and kinetics of Cobalt, Iron, and their alloy: cobalt ferrite electrodeposition from its dissolved ions in a eutectic mixture called Reline (formed by choline chloride and urea), an ionic liquid non-toxic and biodegradable, varying the hydrodynamic conditions, which had not been reported previously from non-aqueous solvents. This kind of alloy has been widely studied, mainly for its hard-magnetic properties that have improved very large amounts of components like information storage systems. Reline is part of the ionic liquids known as deep eutectic solvents (DES) with low vapor pressure, a wide potential range, a high electrical and thermal conductivity, lower cost, and greater stability. Cobalt, Iron, and cobalt ferrite nanoparticles, CoFeNPs, were electrodeposited onto a glassy carbon electrode (GCE), from a DES formed by choline chloride and urea (Reline) in a 1:2 molar ratio containing 50 mM cobalt chloride, CoCl2, and 50 mM iron chloride, FeCl3, at 70 °C. Cyclic voltammetry was used to study the convection effect on the electrodeposition from DES and ascertain the electrodeposition potential range of redox reactions. The chronoamperometric results led to determining the mechanism involved during these electrochemical phase formation processes and the kinetic parameters, such as: the number density of active sites (N0), nucleation rate (A), water reduction constant rate (kwr) and diffusion layer thickness (δ), as a function of the electrode angular speed and electrodeposition potential. These kinetic parameters were obtained from non-linear to the experimental potentiostatic current transients using the Hyde and Compton theoretical equation [1] for Co, Fe and Co-Fe systems under forced convection. The alloyed Fe-Co electrodeposits without agitation were analyzed by the model of Díaz-Morales et al. [2]. On the other hand, the Fe and Co deposits were studied with Heerman and Tarallo model [3]; complemented with M. Palomar – Pardavé et al. model [4] for concomitant reactions. The dominant mechanism of the electrodeposition processes for the three systems was the multiple nucleation with diffusion-limited 3D growth It was found that A increased with the applied potential and that the diffusion layer thickness increased with decreasing angular speed. Water reduction was recognized as concomitant processes in the systems without agitation for the highest applied potentials which were catalyzed mainly by Co deposits. The electrodeposits were characterized by X-rays Energy Dispersive Spectroscopy (EDX) - Scanning Electron Microscopy (SEM) and X-Ray photoelectron spectrometry (XPS) revealed the presence of Co-Fe oxides with spherical morphology, cobalt hydroxide, and metallic cobalt.

Reactive Deposition of Cobalt Using Bis(2,2,6,6-Tetramethyl-3,5-heptanedionato) Cobalt(ii) from Supercritical Carbon Dioxide

Abnormal Behaviors in Electrical Transport Properties of Cobalt-Doped Tin Oxide Thin Films

Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath

Direct copper plating on ultra-thin sputtered cobalt film in an alkaline bath

Atomic Layer Deposition of Cobalt Carbide Thin Films from Cobalt Amidinate and Hydrogen Plasma

Mechanistic study of the atomic layer deposition of cobalt: A combined mass spectrometric and computational approach

Investigation of the Growth Behaviour of Cobalt Thin Films from Chemical Vapour Deposition, Using Directly Coupled X-ray Photoelectron Spectroscopy

Influencia de la convección forzada sobre la cinética de electrodeposición de Fe, Co, y Fe-Co en el disolvente eutéctico profundo Cloruro de Colina-Urea

Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 As a Metal Precursor.

Robust Ni/WC superhydrophobic surfaces by electrodeposition

Cobalt nanoparticle Langmuir-Schaefer films on ethylene glycol subphase

Atomic Layer Deposition of Co x O y Films: Oxidants versus Composition

Rapid preparation of cobalt doped GdBa2Cu3O7-δ films by non-fluorine chemical solution deposition method

Super-flat and uni-oriented cobalt film electrodeposited by modulating the crystal nucleation and growth behavior

Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization

Soft-chemical exfoliation route to layered cobalt oxide monolayers and its application for film deposition and nanoparticle synthesis

Electrodeposition of Ni–Co alloys from a deep eutectic solvent

Carbon monoxide adsorption on cobalt overlayers on a Si(1 1 1) surface studied by STM and XPS

Hollow cathode plasma electron source for low temperature deposition of cobalt films by electron-enhanced atomic layer deposition

Syntheses of Η1‐alkyl‐η3‐allyl‐η5‐cyclopentadienyl Cobalt(III) Complexes and Their Use in Low‐temperature Atomic Layer Deposition of Cobalt‐Containing Thin Films

Carbon monoxide adsorption on cobalt overlayers on a Si(111) surface studied by STM and XPS