Effect of Extrusion Temperature on the Microstructure and Thermal Conductivity of Mg–2.0Zn–1.0Mn–0.2Ce Alloys

Jian Peng,Liping Zhong,Yongjian Wang,Yun Lu,Fusheng Pan
DOI: https://doi.org/10.1016/j.matdes.2015.08.043
IF: 9.417
2015-01-01
Materials & Design
Abstract:This study investigated the effect of extrusion temperature on the microstructure and thermal conductivity of Mg–2.0Zn–1.0Mn–0.2Ce. The thermal conductivity of the alloy was measured using the flash method at room temperature. Results indicated that the volume fraction of un-recrystallized grains decreased and the average grain size of recrystallized grains gradually increased with increasing extrusion temperature. The thermal conductivity of Mg–2.0Zn–1.0Mn–0.2Ce alloys initially increased, reached the maximum value of 131W/(m·K) when the extrusion temperature increased from 340°C to 400°C, and then decreased to 125W/(m·K) when the extrusion temperature further increased to 430°C. The obtained maximum thermal conductivity meets the requirement for Mg alloy radiating module of LED lights. A micro-hardness of approximately 59HV is maintained at extrusion temperature lower than 400°C, while it sharply increases up to 74.0HV when the alloy is extruded at 430°C. The extrusion temperature changes the microstructure and solid solution of elements, which comprehensively affect the thermal conductivity of as-extruded alloys.
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