Investigation On Interfacial Thermal Resistances Of Al/Cu Structure By Using Hybrid Modeling With Multiscale Characteristics

ping yang,yanfang zhao,liqiang zhang,yunqingn tang,haiying yang
DOI: https://doi.org/10.1615/IntJMultCompEng.2014007937
2014-01-01
International Journal for Multiscale Computational Engineering
Abstract:The size effects of interfacial thermal resistance (ITR), interfacial thermal conductivity (ITC), and interfacial region thickness (IRT) of the metal matching structure are investigated by presenting a multiscale method. In this multiscale method, the interface stress element (ISE) method is set as a coupling button to a span-scale model combined with molecular dynamics (MD) and finite element methods (FEM) by HMD-ISE and HISE-FE handshake regions. The Al/Cu structure simulation can illustrate the validity of this numerical evaluation method considering the wire bonding temperature (300 similar to 800 K). The simulation shows that the ITR nonlinear decreases with the increasing of bonding temperature, while the IRT nonlinear increases with the increase of bonding temperature. The ITC nonlinear increases with the increasing of bonding temperature. It indicates that the higher bonding temperature can improve the ITC and IRT of the interface structure. All these are useful for understanding the interfacial properties of wire bonding interface structures. It implies a potential method for design and analysis of the interfacial characteristics in micro-/nanoassembly.
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