An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures
Xu Long,Tianxiong Su,Changheng Lu,Shaobin Wang,Jiaqiang Huang,Chao Chang
DOI: https://doi.org/10.1016/j.ijimpeng.2023.104542
IF: 4.592
2023-02-11
International Journal of Impact Engineering
Abstract:The development of high density and high integration of electronic chips puts forward stricter requirements on electronic packaging structures. Under the premise of lead-free rules, Sn-3.0Ag-0.5Cu (SAC305) has developed into a competitive solder material. However, the reliability of its mechanical properties has been attracting much attentions especially under extreme conditions. In this paper, the high-strain rate experiments are performed by a split-Hopkinson pressure bar (SHPB) to realize different plastic strain rate, while the high temperature environment is achieved by incorporating a heating furnace. By combining these two devices, the dynamic responses of solder specimens can be measured in the strain rate range from 833 s −1 to 1961 s −1 and the temperature conditions of 70°C and 120°C. It is worth noting that as a typical strain-rate hardening process, the maximum stress undergoes an initial ascending stage as the applied strain rate increases. Nevertheless, the hardening process is followed by a descending stage to indicate a softening process of maximum stress due to a further temperature increase during the rapid material deformation at higher strain rates. To gain a further insight into this maximum stress transition, the microstructure characterizations of the impacted solder specimens are carried out by a scanning electron microscope (SEM). It is found that the β-Sn phases and eutectic phases appear to experience refinement and then coarsen as the plastic strain rate continues to increase. A finite element (FE) model is created in the commercial nonlinear FE software ABAQUS/Explicit by considering all the experimental details. Since none of the existing material models in the material library is available for such a maximum stress transition with different ranges of strain rate, the mechanical properties of solder material are emphasized by proposing an improved Johnson-Cook model which can be readily utilized in the numerical evaluations of packaging structures under extremely high strain-rate conditions.
engineering, mechanical,mechanics