Abstract:Low intrinsic thermal conductivity coefficients (λ) of polyimide (PI) films limit their application in heat-prone flexible electronics. By optimizing the liquid crystal range to fit the curing temperature, novel kinds of intrinsically highly thermally conductive liquid crystalline PI (LC-PI) films are fabricated. When the molar ratio of 4,4′-diaminodiphenyl ether (ODA) to 1, 4-bis(4-aminophenoxy)benzene (TPE-Q) is 1:3 (sample no. IV), liquid crystal range of preLC-PIIV films is 272∼388 °C, including curing temperature of 350 °C. The LC-PIIV films cured in liquid crystal range retain liquid crystal texture to room temperature, and the in-plane λ (λ∥) and through-plane λ (λ⊥) at room temperature reach 2.11 W/(m·K) and 0.32 W/(m·K), respectively, significantly higher than λ∥ (0.77 W/(m·K)) and λ⊥ (0.15 W/(m·K)) of LC-PII films which are cured out of the liquid crystal range. Meanwhile, LC-PIIV films possess excellent mechanical and thermal properties, showing application prospects in high-heating flexible electronics.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acs.macromol.1c00686?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acs.macromol.1c00686</a>.S1, experimental section; S1.1, main materials; S1.2, characterizations; S2, supporting results; Figure S1, molecular weight distribution curves of 5 kinds of PAA; Table S1, comparison of characterized number-averaged molecular weight with theoretical values of 5 kinds of PAA; Figure S2, FTIR spectra of 5 kinds of PAA (a), preLC-PI films before curing (b), and preLC-PIIV films after thermal treatment of 250 °C/5 h, 275 °C/5 h, 300 °C/5 h, 325 °C/5 h, and 350 °C/5 h (c); Figure S3, POM images of LC-PII (a), LC-PIII (b), LC-PIIII (c), and LC-PIV (d) films at room temperature; Figure S4, tensile stress–strain curves of LC-PI films; Figure S5, tensile stress–strain curve of N–PI films; and Table S2, thermal characteristic data of LC-PI films (<a class="ext-link" href="/doi/suppl/10.1021/acs.macromol.1c00686/suppl_file/ma1c00686_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

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