Abstract:Four highly rigid spirobifluorene polyimides are designed, and their optical properties are successfully regulated by small side groups and periodic distortions. These units enable well‐balanced thermal and optical properties in CPIs, with 27SPFTFA‐BPAF showing optimal performance (Tavg = 86%, YI = 3.53, Tg = 422 °C, CTE = 35 ppm K−1, δmax = 140 MPa). Advancements in flexible electronic technology, especially the progress in foldable displays and under‐display cameras (UDC), have created an urgent demand for high‐performance colorless polyimide (CPI). However, current CPIs lack sufficient heat resistance for substrate applications. In this work, four kinds of rigid spirobifluorene diamines are designed, and the corresponding polyimides are prepared by their condensation with 5,5′‐(perfluoropropane‐2,2‐diyl) bis(isobenzofuran‐1,3‐dione) (6FDA) or 9,9‐bis(3,4‐dicarboxyphenyl) fluorene dianhydride (BPAF). The rigid and conjugated spirobifluorene units endow the polyimides with higher glass transition temperature (Tg) ranging from 356 to 468 °C. Their optical properties are regulated by small side groups and spirobifluorene structure with a periodically twisted molecular conformation. Consequently, a series of CPIs with an average transmittance ranging from 75% to 88% and a yellowness index (YI) as low as 2.48 are obtained. Among these, 27SPFTFA‐BPAF presents excellent comprehensive performance, with a Tg of 422 °C, a 5 wt.% loss temperature (Td5) of 562 °C, a YI of 3.53, and a tensile strength (δmax) of 140 MPa, respectively. The mechanism underlying the structure‐property relationship is investigated by experimental comparison and theoretical calculation, and the proposed method provides a pathway for designing highly rigid conjugated CPIs with excellent thermal stability and transparency for photoelectric engineering.

Terphenyl-based Colorless and Heat-resistant Polyimides with Controlled Molecular Structure by Methyl Side Groups

Colorless transparent and thermally stable terphenyl polyimides with various small side groups for substrate application

Thermally Stable and Transparent Polyimide Derived from Side‐Group‐Regulated Spirobifluorene Unit for Substrate Application

Synthesis of UV-resistant and colorless polyimide films for optoelectrical applications

Preparation and properties of colorless and transparent semi‐alicyclic polyimide films with enhanced high‐temperature dimensional stability via incorporation of alkyl‐substituted benzanilide units

Colorless Poly(amide-imide)s with Low Dielectric Constants and Enhanced Mechanical Properties through Tri-Armed Cross-Linkers

Super-heat resistant, transparent and low dielectric polyimides based on spirocyclic bisbenzoxazole diamines with Tg > 450 °C

Design, Synthesis and Properties of Semi-Alicyclic Colorless and Transparent Polyimide Films with High Glass Transition Temperatures and Low Retardation for Potential Applications in Flexible Electronics

High comprehensive properties of colorless transparent polyimide films derived from fluorine-containing and ether-containing dianhydride

Short-Side-Chain Regulation of Colorless and Transparent Polyamide-Imides for Flexible Transparent Displays

Synthesis of colorless polyimides derived from benzimidazole diamines with bis‐amide structures

High-Transparency and Colorless Polyimide Film Prepared by Inhibiting the Formation of Chromophores

Synthesis and comparative study of high Tg and colorless polyamide‐imides with different amide‐to‐imide ratio

High-temperature-resistant and Colorless Polyimide: Preparations, Properties, and Applications

Transparent semi-aliphatic polyimide films with excellent thermal stabilities for applications in the display technology

Synthesis and properties of novel colorless and thermostable polyimides containing cross‐linkable bulky tetrafluorostyrol pendant group and organosoluble triphenylmethane backbone structure

Synthesis and properties of novel colorless polyimide containing indene and amide groups

Synthesis of High-Performance Colorless Polyimides with Asymmetric Diamine: Application in Flexible Electronic Devices

Synthesis and properties of polyimides from a diamine containing side diphenylphosphine oxide and trifluoromethyl groups

Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide

Synthesis and Properties of Optically Transparent Fluoro-Containing Polyimide Films with Reduced Linear Coefficients of Thermal Expansion from Organo-Soluble Resins Derived from Aromatic Diamine with Benzanilide Units