Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide

Xueshuang Jiang,Kaijin Chen,Chuying Li,Yubo Long,Siwei Liu,Zhenguo Chi,Jiarui Xu,Yi Zhang
DOI: https://doi.org/10.1021/acsami.3c05664
IF: 9.5
2023-08-25
ACS Applied Materials & Interfaces
Abstract:Colorless polyimides (CPIs) are a key substrate material for flexible organic light-emitting diode (OLED) displays and have attracted worldwide attention. Here, in this paper, the dispersion and interfacial interaction of aromatic polyamide (PA) in CPI (synthesized from 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFMB)) were significantly improved by in situ polymerization, and colorless transparent macromolecular polyimide composites...
materials science, multidisciplinary,nanoscience & nanotechnology
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