Abstract:The properties of polyethylene glycol PEG(Na+)(Cu+) complex on the copper electrodeposition layer was studied by Time-of-Flight Secondary-Ion Mass Spectrometry (TOF-SIMS). The most stable PEG(Na+) fragment, C11H22O6Na+, consists of the central sodium ion surrounded by six ethereal oxygens atoms completed with a pseudo-crown ring. The mechanism of fragmentation pathways leading to the characteristic fragments for complexes PEG(Na+) and smaller fragments PEG(Cu+) was extensively discussed. The adsorption of PEG onto copper is stabilized by counterion effect of sodium ion with the chloride adlayer and hydrophobic interaction. Hydrophobic groups can be oriented towards the chloride adlayer, whilst ethereal oxygen with central sodium ion towards the electrolyte. Consecutively, additional bonds between ethereal oxygen of PEG and copper ions Cu+ (in the CuCl form), identified as a fragments C4H8O2Cu+, stabilize and increase adsorption of PEG molecules. The substitution of HCl as a source of Cl− onto NaCl at adjusted Cl− concentration, diminishes the suppressing abilities of PEG. Under an optimal Na+/Cl− ratio adsorption of PEG also occurs under an open circuit potential. The mechanism of the interaction between complex PEG(Na+)(Cu+) and the chloride adlayer and its importance for a suppressing abilities was provided. Adsorption of PEG(Na+) is strongly dependent on the applied electrode potential. It was also demonstrated that nine charged sodium sites are separated by linking chains, consisting of approximately 12 monomer CH2CH2O units. Our results show that the contamination of copper sulfate by sodium ions plays an important role as a source of sodium ion in forming pseudocrown ethers by polyethylene glycol. Due to this reason, the optimization protocols for suppressing abilities of PEG should take into account molar ratio Na+/Cl− as well as their concentrations. The study proves that a combination of cyclic voltammetry (CV) with TOF-SIMS under the static regime, where substrate wire is withdrawn from a bath in a controlled manner under electrodeposition condition is an extremely powerful tool for the evaluation of changes in chemistry species on the copper surface under real electrodeposition condition.

Investigation of PEG adsorption on copper in Cu 2+ -free solution by SERS and AFM

Revisiting the Polyethylene Glycol-Chloride Adsorption Structure on Cu Electrode in Sulfuric Acid Solution by Wide-Frequency ATR-SEIRAS

The properties of the polyethylene glycol complex PEG(Na+)(Cu+) on the copper electrodeposited layer by Time-of-Flight Secondary-Ion Mass Spectrometry. The new insights

Electroless Deposition Of Copper Alloy In The Peg Additive

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Effect of Molecular Weight of Polyethylene Glycol on Copper Electrodeposition in the Presence of Bis-3-Sulfopropyl-Disulfide

EQCM Study of the Influence of Copper Ions on the Adsorption of Polyethylene Glycol and Bis(sodium sulfopropyl) Disulfide at a Copper Cathode

Effect of the Molecular Weight of Polyethylene Glycol As Single Additive in Copper Deposition for Interconnect Metallization

Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence

An SERS study of the galvanostatic sequence employed for the electrochemical deposition of Copper in the fabrication of Interconnects

Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution

Interaction of Bis-(sodium-sulfopropyl)-Disulfide and Polyethylene Glycol on the Copper Electrodeposited Layer by Time-of-Flight Secondary-Ion Mass Spectrometry

Alkyl-terminated PEG Suppressors for Copper Electroplating and Their Hydrophilic and Hydrophobic Properties

Role of SPS in Chloride Ions and PEG Additive System for Copper Electrocrystallisation

Influence of polyethylene glycol inhibitors on properties of electroplated copper layer

Behavior of polyethylene glycol and block copolymer L64 in microvia filling by copper electroplating

The Effect of Polyethylene Glycols Upon Copper Electrodeposition in Methanesulfonate Electrolytes

A porous material of cross-linked adenine-polyethylene glycol diglycidyl ether for copper ion adsorption

Adsorption Behavior of Triblock Copolymer Suppressors During the Copper Electrodeposition

Electrochemical nucleation and growth of copper on HOPG in presence of PEG and chloride ions as additives

Through silicon via filling by copper electroplating in acidic cupric methanesulfonate bath