Effects Of Grain Grading On Microstructures And Mechanical Behaviors Of Pressureless Solid-State-Sintered Sic

haibo wu,yongjie yan,guilin liu,xuejian liu,yunzhou zhu,zhengren huang,dongliang jiang,yinsheng li
DOI: https://doi.org/10.1111/ijac.12409
2015-01-01
International Journal of Applied Ceramic Technology
Abstract:S-SiC ceramics with >96% of densification degree were derived from 0.8- to 8.6-m graded powders for the first time after sintered at 2210 degrees C. Grain grading generated a 21.8% increase in green density and a 40.8% decrease in sintering shrinkage (low to 12.2%). The introduction of micrometer-sized coarse particles suppressed abnormal grain growth owing to their pinning effect, thus resulting in equiaxial grains. Dramatically improved fracture toughness peaked to 3.77MPam(1/2) at 50wt% of added coarse powder. Sintering mechanism of graded powders can be deduced as the bonding of coarse SiC particle through solid-state sintering of fine powder.
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