Abstract:A need for a drop-in lead-free high temperature solder to replace high lead solders has been stringently desired for the die attachment in SiC power devices. Currently, the gold-based solders (Au-20Sn, Au-12Ge, and Au-3Si eutectic solders) and nano-silver paste are widely applied for their excellent high-temperature properties. But due to high price and high-demand of a processing facility, their applications are hindered. Zn-based solders, which exhibit numerous advantages such as low cost, high melting point, high thermal and electrical conductivity, show their potential uses to replace high lead solders. However, the oxidation and significantly reactions of Zn-based solders on copper substrates lead to excessive Cu-Zn intermetallic compounds (IMCs) at elevated temperature and further makes the joints brittle and easy to fracture. In this work, in order to effectively prohibit the growth speed of Cu-Zn IMCs under harsh environment, a ternary Ni-W-P coating (6-7 wt% of P and 18-19 wt% of W) on copper substrate was developed for its good thermal stability. The interfacial reactions at Cu/Ni-W-P/Zn-5Al interface and Cu/Zn-5Al interface were studied and compared after soldering at 450°C for different time. It was found that Cu-Zn IMCs grew rapidly after soldering for 30 minutes and cracks were observed in IMC layer of Cu/Zn-5Al interface. However, no voids and cracks were found at the Ni-W-P/Zn-5Al interface with the same thermal treatment. Moreo ver, the thickne ss of γ-Ni5Zn21 a nd Al3Ni2 formed in Ni-W-P/Zn-5Al solder joints were quite thin and stable during soldering for different time, which proves the barrier-effect of Ni-W-P layer. These results indicate that Ni-W-P metallization is a promising under bump metallization (UBM) to improve reliability in long term aging and multiple reflow.

Effects Of Ni-W(Au) Coated Cu Microcones On The Bonding Interfaces

Influence Of Au Film Thickness On Surface Morphology And Properties Of Substrate With Ni/Au Microcones

Electrodeposited Ni microcones with a thin Au film bonded with Au wire

Substrate with Ni/Au Microcones Surface for Wire Bonding

Effect Of Solder Alloy Composition On Its Solid-State Bonding Quality With Ni Microcones

Superhydrophobic and anti-corrosion Cu microcones/Ni–W alloy coating fabricated by electrochemical approaches

Effect of Immersion Ni Plating on Interface Microstructure and Mechanical Properties of Al/Cu Bimetal

The Interfacial Reaction between Amorphous Ni-W-P Coating and Sn-58Bi Solder

Exploration of Pretreatment Process and Wettability of High Bonding Ni-P Coatings on W-Cu Composites for Electronic Packaging

The Influence of Solder Oxidation on Low-Temperature Solid-State Bonding Based on Ni Micro-Nano Cones

Structure and wettability control of Cu-Ni-P alloy synthesized by electroless deposition

Effect of Electroless Plated Ni-B Coating on Microstructure and Corrosion Proerties of Al-Cu-Mg Alloy

Diffusion Barrier Property of Electroless Ni-W-P Coating in High Temperature Zn-5Al/Cu Solder Interconnects

A Low-Temperature Solid-State Bonding Method Based on Copper Bump Coated with Nickel Microcones and Silver Buffer

Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection

Low-temperature Solid State Bonding Method Based on Surface Cu–Ni Alloying Microcones

Enhancement effect of Ni on the mechanical and thermodynamic properties of Au-xNi (x=0.5,1.0,1.5,2.0,2.5,3.0) alloy: a first-principles study

Electroless Ni-W-P alloy as a barrier layer between Zn-based high temperature solders and Cu substrates

Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

Influence of Crystalline Structure on Diffusion Barrier Property of Electroless Ni–Fe–P Coatings in Zn–Al Solder Interconnects

Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces