Abstract:The purpose of this study is to experimentally and numerically investigate thermal and residual deformations of plastic ball grid array (PBGA) package and assembly. In the experiments, a full-field shadow moire with a sensitivity of 29.2 mum/fringe is used for measuring their real-time out-of- plane deformations (warpages) during heating and cooling conditions. The elastic moduli (Es) and coefficients of thermal expansion (CTEs) for epoxy molding compound (EMC) and organic substrate are measured in terms of temperatures by dynamic mechanical analyzer (DMA) and thermo-mechanical analyzer (TMA), respectively. And a finite element method with the input of these measured material properties is employed to numerically simulate the thermally-induced deformations of them, in order to understand the insight of mechanics. The full-field warpages of the PBGA package and assembly from shadow moire were documented during the temperature cycling (from room temperature to 220degC). It is interesting that the maximum warpages with concave shape for both the package and assembly occur at near 155degC during this thermal cycling, (rather than with convex shape at room temperature by assuming the warpage-free (or stress-free) temperature is at 175degC of molding). This issue has been resolved through the finite element analyses by cooperating with the residual strain (stress) in the EMC of the package, which is obtained by measuring the residual and thermal deformations of the detached EMC/die bi-material structure. This residual strain of the EMC maybe comes either from the chemical shrinkage of the EMC curing, or more possible stress relaxation of the EMC during the first solder reflow of attaching the solder balls. Furthermore, the thermal deformations for both the package and assembly were fully addressed by the finite element models. Both consistent results indicate that the more severe coplanarity with the value of about 275 mum at the corner of the substrate with the size of 40 times 40 times 1.7 mm occurs at near 155degC, due to the Tg and residual strains of the EMC, rather than at the room temperature. This severe coplanarity can be mitigated by lowering the residual shrinkage strain. And the warpage of the PBGA assembly coincides with the package at the temperature beyond 155degC (highly resulting from apparent creep of the solder balls), but is larger than that of the package below 155degC, due to constraint of the PCB through less-pronounced creep solder balls.

Thermal Stress Measurement of Solder Joints in Bga Packages: Theoretical and Experimental

Predicting fatigue life of Solder joint with submodel method for a BGA package

An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method

Study of thermo-mechanical stress distribution for CBGA package

Thermal performance of lead-free microelectronic BGA package with defects

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Thermal deformation analysis of BGA package by digital image correlation technique

Comparison between Experimental Measurement and Numerical Analysis of Warpage in PBGA Package and Assembly with the Consideration of Residual Strain in the Molding Compound

Modeling and Optimization of Moisture Diffusion and Integrated Thermo-Hygro-Vapor Stress for PBGA Package

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

Thermal stress analysis of PBGA under natural convection using a fluid-solid coupling method

Simulation Study on Thermo-Fatigue Failure Behavior of Solder Joints in Package-On-Package Structure

Geometry Effect on Mechanical Performance and Fracture Behavior of Micro-Scale Ball Grid Array Structure Cu/Sn-3.0ag-0.5cu/Cu Solder Joints

Study of Thermal Deformation of Electronic Package Using Scanning Moire Method with High Resolution Microscopy

Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres

Experiments and Hygrothermal Stress Analysis for a QFN Package.

Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

Study of Accelerated Shear Creep Behavior and Fracture Process of Micro-Scale Ball Grid Array (BGA) Structure Cu/Sn–3.0Ag–0.5Cu/Cu Joints under Coupled Electro-Thermo-mechanical Loads

Warpage measurement and simulation of flip-chip PBGA package under thermal loading