Current conduction mechanisms of 0.65 nm equivalent oxide thickness HfZrLaO thin films

Hung-Wen Chen,H. W. Hsu,Shuang-Yuan Chen,Heng-Sheng Huang,Mu-Chun Wang,Chuan-Hsi Liu
DOI: https://doi.org/10.1109/inec.2011.5991686
2011-01-01
Abstract:Metal-oxide-semiconductor (MOS) capacitors incorporating atomic-layer-deposited (ALD) LaO/HfZrO stacked gate dielectrics were fabricated. The experimental results reveal that the equivalent oxide thickness (EOT) is 0.65 nm, and the gate leakage current density (Jg) is only 1.9 A/cm2. The main current conduction mechanisms are Schottky emission, Poole-Frankel emission, and Fowler-Nordheim tunneling. The barrier height (Φ B ) is estimated to be about 1.07 eV at TaC and HfZrLaO interface.
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