Ternary Composites of Linear and Hyperbranched Polyimides with Nanoscale Silica for Low Dielectric Constant, High Transparency, and High Thermal Stability

Seongku Kim,Shinji Ando,Xiaogong Wang

DOI: https://doi.org/10.1039/c5ra05227k

IF: 4.036

2015-01-01

RSC Advances

Abstract:A new series of ternary polyimide–silica composites was developed to obtain polymer films with low dielectric constant, high optical transparency, and good thermal stability.

What problem does this paper attempt to address?

Hybrid Ternary Composites of Hyperbranched and Linear Polyimides with Sio2: A Research for Low Dielectric Constant and Optimized Properties

Seongku Kim,Xingyuan Wang,Shinji Ando,Xiaogong Wang

DOI: https://doi.org/10.1039/c4ra06546h

IF: 4.036

2014-01-01

RSC Advances

Abstract:The hybrid ternary composites with low dielectric constant and high thermal stability were fabricated through composition optimization by introducing suitable amounts of inorganic silica and hyperbranched polyimide into a linear polyimide system.
Highly Dispersible Ternary Composites with High Transparency and Ultra Low Dielectric Constants Based on Hyperbranched Polyimide with Organosilane Termini and Cross-Linked Polyimide with Silica

Seongku Kim,Shinji Ando,Xiaogong Wang

DOI: https://doi.org/10.1039/c5ra20722c

IF: 4.036

2015-01-01

RSC Advances

Abstract:Flexible insulating materials that are both thermally and mechanically stable, highly transparent, and have low dielectric constants are highly desirable for electronic applications.
Preparation and Dielectric Properties of Polyimide/silica Nanocomposite Films Prepared from Sol–gel and Blending Process

Wei-Dong Liu,Bao-Ku Zhu,Jian Zhang,You-Yi Xu

DOI: https://doi.org/10.1002/pat.910

IF: 3.348

2007-01-01

Polymers for Advanced Technologies

Abstract:Using poly(amic acid) (PAA) as a precursor followed by thermal imidization, the polyimide/silica nanocomposite films were prepared via an improved sol-gel process and a blending process, respectively. FT-IR, TEM and TGA measurements were used to characterize the structure and properties of the obtained films. The results confirmed that the introduction of silica did not yield negative effects on the conversion of the PAA precursor to the polyimide. With the increase of silica content, the aggregation of silica appeared in the polyimide matrix, and the thermal stability decreased slightly for both kinds of films. The dielectric constant (epsilon) of both films increased slowly with the increase of the silica concentration. The dielectric constant of the obtained polyimide/silica nanocomposite films displayed good stability within a wide range of temperatures or frequency. Based on modeling relation between epsilon and silica content, the difference in dielectric properties for two kinds of nanocomposites are discussed. Copyright (c) 2007 John Wiley & Sons, Ltd.
Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

J Zhang,BK Zhu,HJ Chu,YY Xu

DOI: https://doi.org/10.1002/app.21721

IF: 3

2005-01-01

Journal of Applied Polymer Science

Abstract:A series of hybrid polyimide-silica hybrids films were prepared by a sol-gel process via the blending of tetrathoxysilane and a coupling reagent in a pyromellitic anhydride/4,4'-oxydianiline (ODA) based poly(amic acid) solution in N,N-dimethylacetamide, the casting of the films, the evaporation of the solvent, and thermal imidization, in that order. Fourier transform infrared, transmission electron microscopy, atomic force microscopy, and thermogravimetric analysis were used to characterize the structure of the obtained hybrids. The dispersion of silica in the hybrids was suggested to be in two states: a dominant network structure and minor discrete aggregate particles. On the basis of the network structure, the mechanical behavior of the hybrids was interpreted. An investigation of the dielectric properties revealed that the dielectric constant of the hybrids increased slowly with the concentration of SiO2. For hybrid films containing 30 wt % SiO2, the constant increased to 4.2 from the value of 3.2 for pure polyimide. Moreover, the incomplete hydrolysis and decomposition of tetrathoxysilane and the coupling reagent were the main factors contributing to the thermal stability and the uncertainty of the dielectric constant of the hybrids. (c) 2005 Wiley Periodicals, Inc.
Low Dielectric and Thermally Stable Hybrid Ternary Composites of Hyperbranched and Linear Polyimides with Sio2

Seongku Kim,Xingyuan Wang,Shinji Ando,Xiaogong Wang

DOI: https://doi.org/10.1039/c4ra02956a

IF: 4.036

2014-01-01

RSC Advances

Abstract:A hydroxyl-terminated hyperbranched polyimide was synthesized via the A2 + B3 reaction between dianhydride and triamine monomers. The hydroxyl groups at the peripheral positions were then introduced by modification of the anhydride end groups via a reaction with 4-aminophenol. Based on the hydroxyl-terminated hyperbranched polyimide, HBPIBPADA-TAP(OH), we successfully fabricated hybrid ternary composites, which were comprised of a linear polyimide (PI6FDA-APB), HBPIBPADA-TAP(OH), and an inorganic SiO2 component. The material was designed to satisfy the requirement for cutting-edge insulators with a low dielectric constant and a high thermal stability. Because of the appropriate choice of the hybrid ternary composite systems with HBPIBPADA-TAP(OH) and inorganic silica, it is sensible to improve the dielectric properties and thermal resistant properties of unary systems or improve the disadvantages of the dielectric and optical properties of binary systems. For an optimized composition, the dielectric constant (Dk) of the PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% composite reaches the lowest value of 2.24 at 100 kHz. Research also showed that the optical transparency is significantly improved with the increase of the HBPIBPADA-TAP(OH) content in the composite. Compared with the binary linear PI 6FDA-APB–SiO2 composite, the transmittance increases from 1% to 75% at the wavelength of 450 nm. The incorporation of SiO2 can preserve the good thermal properties of the hybrid composites containing HBPIBPADA-TAP(OH). By adding 10% of HBPIBPADA-TAP(OH) to the PI6FDA-APB–SiO2-20% system, the coefficient of thermal expansion of the hybrid ternary composite is 20.9 ppm °C−1 in the temperature range from 100 to 150 °C, which is significantly lower than that of the linear polyimide (37.1 ppm °C−1 for PI6FDA-APB). Because of these optimized properties, hybrid ternary composites have the potential for use in applications in the micro-electronic insulator fields, such as interlayer dielectrics of advanced electronic devices.
Mechanically Strong, Transparent Polyimide Composite Thin Films with a Low Dielectric Constant

He Bai,Yunting Hu,Yongliang Zhao,Xiaomin Zhu,Jianhua Hu,Haitao Wang

DOI: https://doi.org/10.1016/j.coco.2024.102129

IF: 8

2024-01-01

Composites Communications

Abstract:Aromatic polyimide is widely used in microelectronics as dielectric packaging layers. There is a high demand to reduce its dielectric constant to meet the fast development of communication technology. Here we report a simple and eco-friendly approach to preparing polyimide films with a lowered dielectric constant by adding silica hollow nanospheres with an average size of 100 nm in an aqueous solution of poly(amic acid) salt, and subsequent film casting and thermal imidization. The silica hollow nanospheres present a uniform distribution in polyimide matrix after surface modification with 3-aminopropyltriethoxysilane. The dielectric constant of the resulting composite films decreases linearly with particle loading till 15 wt% and reaches the lowest value of 2.5. The surface hardness and elastic modulus of the films improve by adding hollow nanospheres, while maintaining high optical transparency, high flexibility and a low coefficient of thermal expansion.
Polyimide/fluorinated silica composite films with low dielectric constant and low water absorption

Bingliang Huang,Ke Li,Mingyun Peng,Jie Cheng

DOI: https://doi.org/10.1177/09540083211073657

IF: 1.73

2022-02-14

High Performance Polymers

Abstract:In this study, KMnO4 was applied as an etchant to partially decompose the silica microspheres into mesoporous structures. 1H,1H,2H,2H-perfluorodecyltriethoxysilane was grafted onto the surface of the hollow silica. A fluorinated silica/polyimide hybrid material was prepared. Meanwhile, the influence of fluorinated silica on the dielectric property and moisture absorption property of the hybrid material was discussed. It is found that the fluorinated silica can lower the dielectric constant and hygroscopicity of the hybrid film. The fluorinated silica is characterized by strong hydrophobicity, good dispersibility, and good thermal stability. Even at a very low filling level of only 2 wt%, the dielectric constant of the polyimide hybrid is significantly reduced to 2.61 without sacrificing thermal stability. The water absorption rate of the polyimide hybrid film is reduced from approximately 3.1% to 2.1 wt%. Moreover, this provides a new idea for reducing the dielectric and water absorption properties of materials.

polymer science
Highly transparent triethoxysilane-terminated copolyimide and its SiO 2 composite with enhanced thermal stability and reduced thermal expansion

shinji ando

DOI: https://doi.org/10.1016/j.eurpolymj.2015.01.012

IF: 6

2015-01-01

European Polymer Journal

Abstract:A highly transparent and colorless copolyimide was synthesized to contain electron withdrawing sulfone, fluorine atom and triethoxysilane-terminal groups. Based on the copolyimide, a series of composites of the copolyimide with inorganic SiO2 network was successfully fabricated, which showed improved properties for possible applications in transparent insulators and other devices.
Poly(methyl Methacrylate)/silica/titania Ternary Nanocomposites with Greatly Improved Thermal and Ultraviolet-Shielding Properties

Haitao Wang,Peng Xu,Sheng Meng,Wei Zhong,Weichuan Du,Qiangguo Do

DOI: https://doi.org/10.1016/j.polymdegradstab.2005.10.008

IF: 5.204

2005-01-01

Polymer Degradation and Stability

Abstract:Poly(methyl methacrylate) (PMMA)/silica/titania ternary nanocomposites with covalent bonding interaction between polymer and inorganic phases have been prepared using a novel non-hydrolytic sol–gel method. Transmission electron microscope (TEM) image of silica/titania binary inorganic component indicates a core-shell-like structure. Scanning electron microscope (SEM) images suggest that the well dispersed silica/titania particles in the hybrid are on the nanometer-scale. The transparencies of nanocomposites are maintained in visible region while the absorption band in ultraviolet (UV) region is red shifted with increasing inorganic content. The thermogravimetric analysis (TGA) results show that the thermal stability of PMMA copolymer increases dramatically with the addition of silica/titania moieties both in nitrogen and in air.
Ultra-low-? Polyimide Hybrid Films Via Copolymerization of Polyimide and Polyoxometalates

Honggang Chen,Long Xie,Hongbin Lu,Yuliang Yang

DOI: https://doi.org/10.1039/b618910e

2007-01-01

Journal of Materials Chemistry

Abstract:Novel polyimide hybrid films in which nanoscale polyoxometalates (POM) clusters are covalently linked with the polymer chains exhibit not only drastically reduced dielectric constants relative to neat polyimide film, as low as 1.22, but also improved thermal stability, and mechanical properties without sacrificing the transparency of the polymer films.
Effect of Hyperbranched Polyimide on Nanoscale Dispersion of SiO2 in Linear Polyimides

Seongku Kim,Shinji Ando,Xiaogong Wang

2015-01-01

Abstract:It is of particular interest in developing organic-inorganic composites based on polyimides (PIs) for improving the insulating, dielectric, and optical properties of flexible wiring boards. 1, 2 However, inorganic particles in micron-scale usually cause opaqueness and has not shown a strong demand for application as functional transparent composites. The hyperbranched polymers have received much attention in a variety of fields, because of the unique properties, such as low solution viscosity, high solubility, increasing free volume, as compared with their linear analogues. 1, 3, 4 Therefore, we synthesized a hydroxyl terminated hyperbranched polyimide 1, 2 as a component to satisfy the requirements for cutting-edge insulators with low dielectric constants and high thermal stability as well as to reduce inorganic particle sizes by controlling the interactions between polyimide backbone and silica phase for transparency. Then, based on the hydroxyl-terminated hyperbranched polyimide (HBPIBPADA-TAP(OH)), we successfully fabricated hybrid ternary composites which comprised of a linear polyimide (PI6FDA-APB), HBPIBPADA-TAP(OH), and inorganic SiO2 component by traditional ‘Sol-Gel’ method. It is complementary to improve the dielectric and thermal resistant drawbacks of unary systems and the dielectric and optical drawbacks of binary systems. 1, 2 For an optimized composition, the dielectric constant (Dk) of the PI6FDA-APB_HBPIBPADA-TAP(OH)-30%_SiO220% composite reaches the lowest value of 2.24 at 100 kHz. Moreover, the optical transparency is significantly improved with the increase of the HBPIBPADA-TAP(OH) content in the composite. Compared with the binary composite (PI 6FDA-APB_SiO2), the optical transmittance increases from 1 % to 75 % at the wavelength of 450 nm. Without the hyperbranched component, the aggregated silica particles can be clearly seen as spherical beads with smooth surface. By using the hyperbranched PI, the particle size of SiO2 is significantly reduced, from an average diameter around 1500 nm to 100-200 nm. The incorporation of SiO2 can preserve the good thermal properties of the hybrid composites containing HBPIBPADA-TAP(OH). By adding
Preparation, Morphological and Thermal Stability of Polyimide/Silica Hybrid Material Containing Dye Nbdpa

FX Qiu,YM Zhou,JZ Liu,XP Zhang

DOI: https://doi.org/10.1016/j.dyepig.2005.05.009

IF: 5.122

2006-01-01

Dyes and Pigments

Abstract:In this study, two series of the polyamide/silica NLO hybrid composites with covalent links between the inorganic and the organic networks were synthesized by the sol–gel method. These polyimide hybrid waveguide materials were prepared using a commercially available, 4,4′-(hexafluoro-isopropylidene)diphthalic arhydride (6FDA) or pyromellitic dianhydride (PMDA) as dianhydride, N-methyl-N-[4-[(6-nitrobenzothiazol-2-yl)diazenyl]phenyl]-2-aminoethano (NBDPA) as NLO-chain dye chromophore, 3-aminopropyltriethoxysilane (APTES) as a coupling agent between the organic and inorganic phase, and a metal alkoxide tetraethylorthosilicate (TEOS). The TEOS content in the hybrid films was varied from 0 to 22.5wt%. The prepared polyimide/silica hybrids were characterized by IR, thermogravimetric analysis (TGA), X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), etc. They exhibited fairly good optical transparency. The SiO2 phase was well dispersed in the polymer matrix. DSC and TGA results showed that these hybrid materials had excellent thermal stability. The refractive index decreased linearly with the increasing TEOS fraction in the hybrid films. The experimental results suggested that the hybrid thin films had potential applications as passive films for optical devices.
Polyimide/silica/titania Nanohybrids Via a Novel Non-Hydrolytic Sol–gel Route

HT Wang,W Zhong,P Xu,QG Do

DOI: https://doi.org/10.1016/j.compositesa.2004.12.008

2005-01-01

Abstract:Polyimide/silica/titania hybrid films were prepared via a non-hydrolytic sol–gel route. Silicic acid and titanium tetrachloride were used as the precursors of silica and titania, respectively. The absorption band of Si–O–Ti bonds in FTIR spectra of the hybrid films revealed the formation of the hybrid inorganic network between SiO2 and TiO2. Scanning electron microscopy results indicated that the nanometer-scaled inorganic domains were homogeneously dispersed in polyimide matrix due to the introduction of silica-stabilized TiO2 and the interactions between organic and inorganic phases. The studies on the optical properties of the hybrid films indicated the red-shift of the absorption band increased with increasing TiO2 content, while all the hybrid films maintained their transparencies. The surface resistances of the hybrid samples decreased with increasing TiO2 content. The thermal decomposition temperature of the ternary hybrid films decreased slightly with increasing TiO2 content. This kind of hybrid materials may have potential application in the preparation of opto-electronic devices.
Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere

Ke Li,Lin Yang,Lin Yang,Liu He,Juan Du,Xinyue Li

DOI: https://doi.org/10.1002/pen.26910

2024-08-09

Polymer Engineering & Science

Abstract:Low dielectric polyimide microsphere/polyimide composite films composite film with good comprehensive properties was prepared by thermal imidization of polyamic acid in the presence of porous polyimide microspheres. A low dielectric polyimide/polyimide microsphere (PI/PM) composite film was constructed by thermal imidization of polyamic acid from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) in the presence of porous PM. The PM particles with particle size of about 2 μm were prepared via the solvothermal method using 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and ODA as monomers through thermal imidization. Due to the favorable compatibility between the porous PM and PI matrix, the mechanical properties, thermal stability, and dielectric properties of the obtained composite films were significantly improved. The PI/PM composite films had a tensile strength of 44.18–64.32 MPa, and the corresponding elongation at break of 6.21%–11.7%. Furthermore, the thermogravimetric temperatures of T5% were 538.9–563.7°C. The dielectric constants of the composite films at 1 MHz were 2.59–3.68, and the corresponding dielectric loss were only 0.0119–0.00405. Thus, the combination of excellent mechanical properties, high thermal stability, extremely low dielectric constant, and dielectric loss make the composite films ideal for deployment as high‐performance materials for 5G applications. Highlights Low dielectric polyimide composite film was prepared by thermal imidization of polyamic acid in the presence of porous polyimide microspheres. Porous polyimide microspheres were prepared by thermal using the imidization solvothermal method. Low dielectric polyimide composite film with good comprehensive properties.

engineering, chemical,polymer science
Highly Transparent and Colorless Polyimide Film with Low Dielectric Constant by Introducing Meta-substituted Structure and Trifluoromethyl Groups

Hong-Tao Zuo,Feng Gan,Jie Dong,Peng Zhang,Xin Zhao,Qing-Hua Zhang

DOI: https://doi.org/10.1007/s10118-021-2514-2

2020-11-10

Chinese Journal of Polymer Science

Abstract:An effective design strategy for preparing highly transparent polyimide film with low dielectric constant is presented. The key to the strategy is to simultaneously introduce meta-substituted structure and trifluoromethyl in polymer chains. By using this design strategy, a highly transparent polyimide film with low-k was synthesized from 3,5-diaminobenzotrifluoride (m-TFPDA) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) through a two-step method. The obtained m-TFPDA/6FDA (CPI) film (∼30 µm) possesses high optical transparency (λcutoff=334 nm, T450nm=85.26%, Haze=0.31) and is close to colorless (L*=96.03, a*=−0.34, b*=2.12, yellow index=3.96). The intrinsic k and dielectric loss value of the film are 2.27 and 0.0013 at 10 kHz, respectively. More importantly, such low dielectric performance could remain stable up to 280 °C, and the film shows a low moisture rate (∼0.51%), which helps to maintain the low-k property stability in different humid environments. Meanwhile, the film also shows good thermal stability and mechanical properties, with a glass transition temperature (Tg) of 296 °C and the 5 wt% decomposition temperature (Td,5%) of 522 °C under N2. The tensile strength and tensile modulus of the film are 85.1 MPa and 1.96 GPa, respectively. In addition, the film is soluble in common solvents, which allows simple solution processing and low-cost, continuous roll-to-roll processes. This design strategy is beneficial to improving the transparency, lightening yellow color, lowering the dielectric constant and meanwhile maintaining the comprehensive properties of polyimide films, which is mainly due to the introduced meta-substituted and trifluoromethyl structures effectively inhibiting the transfer of charge transfer complex (CTC) effects and increasing the free volume of film. This design strategy could also be extended to other high-performance polymer systems.

polymer science
Effect of simultaneously introduced bulky pendent group and amide unit on optical transparency and dimensional stability of polyimide film

Hongtao Zuo,Yuting Chen,Guangtao Qian,Fen Yao,Haibei Li,Jie Dong,Xin Zhao,Qinghua Zhang

DOI: https://doi.org/10.1016/j.eurpolymj.2022.111317

IF: 6

2022-06-15

European Polymer Journal

Abstract:Monomers of 4,4′-((4-(trifluoromethyl)phenyl)methylene)bis(2,6-dimethylaniline) (3FTMDT) and N,N'-(2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diyl)bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxamide) (TA-TFMB) were synthesized and designed to fabricate polyimide film with simultaneously designed bulky pendent group and amide unit in polymer chains and their effects on the optical transparency and dimensional stability of films were investigated in detail. The prepared polyimide (3FTMDT/TA-TFMB) film possesses highly optical transparency (λcutoff = 384 nm, T450 nm = 81%, Haze = 0.86) and lighter color (L*=95.09, a*=-2.14, b*=6.44) with the in-plane coefficient of linear thermal expansion of 45 ppm/oC. Meanwhile, the film presents good thermal stability and mechanical properties, with a glass transition temperature (Tg) of 337 °C and 5 wt% decomposition temperature of 459 °C under N2, the fracture strength and tensile modulus of the film are 105 MPa and 2.2 GPa, respectively. The film also exhibits low dielectric performances with intrinsic dielectric constant of 2.29 and dielectric loss of 8 × 10-3 at 10 KHz, and which could keep stable up to 280 °C. In addition, the film shows good solubility in common solvents and is easy to be processed. The highly transparent polyimide film with reduced coefficient of linear thermal expansion is expected to be used as substrate material for flexible display or other photoelectric fields.

polymer science
Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Xuexin Zhang,Yao Dou,Liqun Liu,Meixuan Song,Zhenhao Xi,Yisheng Xu,Weihua Shen,Jie Wang

DOI: https://doi.org/10.3390/polym16070901

IF: 5

2024-03-26

Polymers

Abstract:In order to prepare polyimide (PI) films with a low dielectric constant and excellent comprehensive performance, a two-step method was employed in this study to integrate β-cyclodextrin into a semi-aromatic fluorine-containing polyimide ternary system. By introducing trifluoromethyl groups to reduce the dielectric constant, the dielectric constant was further reduced to 2.55 at 10 MHz. Simultaneously, the film exhibited noteworthy thermal stability (a glass transition temperature exceeding 300 °C) and a high coefficient of thermal expansion. The material also demonstrated outstanding mechanical properties, boasting a strength of 122 MPa and a modulus of 2.2 GPa, along with high optical transparency (transmittance reaching up to 89% at 450 nm). Moreover, the inherent high transparency of colorless polyimide (CPI) combined with good stretchability contributed to the attainment of a low dielectric constant. This strategic approach not only opens up new opportunities for novel electroactive polymers but also holds potential applications in flexible displays, circuit printing, and chip packaging.

polymer science
Dielectric Properties of Polyimide/Mesoporous Silica Composite Films

Zhi‐Min Dang

2008-01-01

Abstract:Polyimide/mesoporous silica(PI/MCM-41) composite films were prepared by using in-situ dispersive polymerization.The structure of hexagonal MCM-41 was observed with powder X-ray diffraction(XRD) and transmission electron microscope(TEM).Meanwhile,the dispersion of MCM-41 was observed with scanning electron microscope(SEM).Moreover,the dependence of dielectric properties of the composite films on MCM-41 loading was studied.The results show that the volume resistivity and dielectric strength of the composite films increased simultaneously.The volume resistivity of the composite films with 3.0wt% MCM-41 is 10 times as large as that of pure PI film,and increased from 2.8×1014 Ω·m to 2.1×1015 Ω·m.Meanwhile,the dielectric constant of the composite film decreased from 3.26 to 2.86 and the dielectric loss just deteriorated slightly.
Preparation and Characterization of Polyimide/Fluorinated Silicate Nano-Hybrid Thin Films with Low Refractive Indices

Yulai Han,Junji Wakita,Shigeki Kuroki,Xiaogong Wang,Shinji Ando

DOI: https://doi.org/10.2494/photopolymer.21.143

2008-01-01

Journal of Photopolymer Science and Technology

Abstract:-octylsilane (13FTES) andtetraethoxysilane (TEOS) were employed to prepare the silicate precursors. Furthermore,2-aminopropyl triethoxysilane (APrTEOS) was used as a coupling agent to improve thecompatibility between the polymeric and inorganic domains of the nano-hybrid materials.The chemical structures of organo-silicate and hybrid materials were examined with solidstate
Porous polyimide composite films containing mesoporous hollow silica nanospheres with ultralow dielectric constant and dissipation loss

Jirayu Yuenyongsuwan,Ju Hyun Oh,Yong Ku Kwon

DOI: https://doi.org/10.1016/j.polymer.2024.127694

IF: 4.6

2024-10-26

Polymer

Abstract:Porous polyimide hybrid films with ultralow dielectric constant and dissipation loss were synthesized during chemical imidization and rapid evaporation of polymer solutions. Polyimide (PI) of bis(4-aminophenyl)-1,4-diisopropylbenzene (BISP) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) were synthesized in N-methylpyrrolidinone (NMP) to yield the corresponding poly(amic acid)s (PAA)s, which were then chemically imidized. To reduce the dielectric properties of the porous PI films, amine-functionalized, surface-modified hollow silica nanoparticles (AHNS) with various sizes from 100 nm to 1 μm, prepared via sol-gel process, were added with PAA at 3, 5, or 10 % weight content, followed by chemical imidization to produce the porous PI/AHNS films. To avoid the high-volume shrinkage of wet gels and maintain the high porosity of the PI with low polarizability, AHNS nanoparticles were added to the porous structure of the PI xerogels as a physical crosslinker. The polyimide hybrid film with 10 nm AHNS nanoparticles at 10 % weight content showed a dielectric constant of 1.151 and a dissipation rate of 0.001 at a frequency of 10 GHz.

polymer science

Ternary Composites of Linear and Hyperbranched Polyimides with Nanoscale Silica for Low Dielectric Constant, High Transparency, and High Thermal Stability

Hybrid Ternary Composites of Hyperbranched and Linear Polyimides with Sio2: A Research for Low Dielectric Constant and Optimized Properties

Highly Dispersible Ternary Composites with High Transparency and Ultra Low Dielectric Constants Based on Hyperbranched Polyimide with Organosilane Termini and Cross-Linked Polyimide with Silica

Preparation and Dielectric Properties of Polyimide/silica Nanocomposite Films Prepared from Sol–gel and Blending Process

Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

Low Dielectric and Thermally Stable Hybrid Ternary Composites of Hyperbranched and Linear Polyimides with Sio2

Mechanically Strong, Transparent Polyimide Composite Thin Films with a Low Dielectric Constant

Polyimide/fluorinated silica composite films with low dielectric constant and low water absorption

Highly transparent triethoxysilane-terminated copolyimide and its SiO 2 composite with enhanced thermal stability and reduced thermal expansion

Poly(methyl Methacrylate)/silica/titania Ternary Nanocomposites with Greatly Improved Thermal and Ultraviolet-Shielding Properties

Ultra-low-? Polyimide Hybrid Films Via Copolymerization of Polyimide and Polyoxometalates

Effect of Hyperbranched Polyimide on Nanoscale Dispersion of SiO2 in Linear Polyimides

Preparation, Morphological and Thermal Stability of Polyimide/Silica Hybrid Material Containing Dye Nbdpa

Polyimide/silica/titania Nanohybrids Via a Novel Non-Hydrolytic Sol–gel Route

Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere

Highly Transparent and Colorless Polyimide Film with Low Dielectric Constant by Introducing Meta-substituted Structure and Trifluoromethyl Groups

Effect of simultaneously introduced bulky pendent group and amide unit on optical transparency and dimensional stability of polyimide film

Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Dielectric Properties of Polyimide/Mesoporous Silica Composite Films

Preparation and Characterization of Polyimide/Fluorinated Silicate Nano-Hybrid Thin Films with Low Refractive Indices

Porous polyimide composite films containing mesoporous hollow silica nanospheres with ultralow dielectric constant and dissipation loss