Improving Uv Laser Damage Threshold Of Fused Silica Optics By Wet Chemical Etching Technique

Hui Ye,Yaguo Li,Zhigang Yuan,Jian Wang,Qiao Xu,Wei Yang
DOI: https://doi.org/10.1117/12.2186007
2015-01-01
Abstract:Fused silica is widely used in high-power laser systems because of its good optical performance and mechanical properties. However, laser damage initiation and growth induced by 355 nm laser illumination in optical elements have become a bottleneck in the development of high energy laser system. In order to improve the laser-induced damage threshold (LIDT), the fused silica optics were treated by two types of HF-based etchants: 1.7% wt. HF acid and buffer oxide etchant (BOE: the mixture of 0.4% wt. HF and 12% wt. NH4F), respectively, for varied etching time. Damage testing shows that both the etchants increase the damage threshold at a certain depth of material removal, but further removal of material lowers the LIDT markedly. The etching rates of both etchants keep steady in our processing procedure, similar to 58 mu g/min and similar to 85 mu g/min, respectively. The micro-surface roughness (RMS&PV) increases as etching time extends. The hardness (H) and Young's modulus (E) of the fused silica etched for diverse time, measured by nano-indenter, show no solid evidence that LIDT can be related to hardness or Young's modulus.
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