III-Von-nothing Metal-Oxide-semiconductor Field-Effect Transistors Enabled by Top-Down Nanowire Release Process : Experiment and Simulation

J. J. Gu,O. Koybasi,Y. Q. Wu,P. D. Ye
DOI: https://doi.org/10.1063/1.3638474
IF: 4
2011-01-01
Applied Physics Letters
Abstract:III-V-on-nothing (III-VON) metal-oxide-semiconductor field-effect transistors (MOSFETs) are experimentally demonstrated with In0.53Ga0.47As as channel and atomic layer deposited Al2O3 as gate dielectric. A hydrochloric acid based release process has been developed to create an air gap beneath the InGaAs channel layer, forming the nanowire channel with width down to 40 nm. III-VON MOSFETs with channel lengths down to 50 nm are fabricated and show promising improvement in drain-induced barrier lowering, due to suppressed short-channel effects. The top-down processing technique provides a viable pathway towards fully gate-all-around III-V MOSFETs.
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