Interfacial Reactions in Ni/CoSb3 Couples at 450 °C

Wei-an Chen,Sinn-wen Chen,Ssu-ming Tseng,Haw-wen Hsiao,Yang-yuan Chen,G. Jeffrey Snyder,Yinglu Tang
DOI: https://doi.org/10.1016/j.jallcom.2015.01.176
IF: 6.2
2015-01-01
Journal of Alloys and Compounds
Abstract:CoSb3-based alloys are promising thermoelectric materials, and nickel is commonly used as barrier layer. This study examines interfacial reactions in the Ni/Sb and Ni/CoSb3 couples reacted at 723K. Three reaction phases, Ni5Sb2, NiSb and NiSb2, are found in the Ni/Sb couples. In the Ni/CoSb3 couples, the reaction path is Ni/Ni5Sb2/(Co,Ni)Sb/CoSb3. Nickel is the fastest diffusion species, and the growth front is at the (Co,Ni)Sb/CoSb3 interface. Co is the second fastest diffusion species, and a Co-rich region is formed at the Ni phase. The reaction layers grow with longer reaction time. Their average growth rates in the Ni/Sb and Ni/CoSb3 couples reacted for 20h are 1.1μm/h and 1.0μm/h, respectively.
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