Interfacial Reactions in Ni/PbSe

Al-Azhar University,Chen Sinn-wen

DOI: https://doi.org/10.1007/s11664-020-08344-y

IF: 2.1

2020-01-01

Journal of Electronic Materials

Abstract:PbSe-based alloys are promising thermoelectric materials, and in these materials, nickel is commonly used as barrier layer. This study investigates the interfacial reactions in Ni/PbSe couples reacted at 250°C, 300°C, 350°C and 400°C. The reaction couples are prepared by electroplating a Ni layer on PbSe substrates. Experimental results show that one reaction phase, Ni3Pb2Se2, is formed in the Ni/PbSe couples reacted at 300°C, 350°C and 400°C, but no interfacial reaction occurs at 250°C. The reaction layer grows thicker with higher temperature and longer reaction time. The growth rate constants at 300°C, 350°C and 400°C are 1.8, 3.5 and 11.8 $$ \upmu{\hbox{m/}}\sqrt {\hbox{d}} $$ , respectively. It is concluded that the reaction path is Ni/Ni3Pb2Se2/PbSe, and that nickel is the fastest diffusion species in the Ni/PbSe couples.