Fabrication of Current-Induced Magnetization Switching Devices Using Etch-Back Planarization Process

YF Ding,M Pakala,P Nguyen,H Meng,YM Huai,JP Wang
DOI: https://doi.org/10.1063/1.1847971
IF: 2.877
2005-01-01
Journal of Applied Physics
Abstract:A patterning process for nanoscale current-perpendicular-to-plane magnetic devices was developed. Spin valve and magnetic tunnel junction (MTJ) pillars are patterned using electron-beam lithography and subsequent hard mask deposition and ion milling. Photoresist etch-back method is used to planarize the insulation layer, deposited on top of the spin valve/MTJ pillars, prior to top lead deposition. This method allows for a reduction of shadowing effect associated with the use of resist mask for ion milling. Critical switching current of ∼6×107A∕cm2 was observed for spin valve nanopillars with clear field dependence of the switching current, which is comparable to the reported value for metallic system.
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