Abstract:Cyclic deformation behaviour of a [(4) over bar 15 20]-[18 (2) over bar 7] copper bicrystal with a tilting Sigma = 19b grain boundary (GB) was investigated in the axial plastic strain range 1.5 x 10(-4) -2.13 x 10(-3) at room temperature in air. The primary slip planes (111) within the G(1)[(4) over bar 15 20] and G(2)[18 (2) over bar7] grains in the bicrystal were designed to be coplanar in order to reveal the interaction of slip bands with the GB. The results show that the cyclic stress-strain curve of the bicrystal displays a plateau region with axial saturation stresses of 61.6-63.5 MPa over the applied strain range. This result is similar to that for a single-slip-oriented copper single crystal, indicating that the GB has little effect on the saturation stress. After cyclic deformation, the surface morphology of the bicrystal exhibits the following features. Firstly, only the primary slip system was activated in both grains. Secondly, the primary slip bands on the four surfaces of the two grains show a good one-to-one relationship across the GB, indicating that surface slip bands can transfer through it. Thirdly, secondary slip systems were not activated, even in the vicinity of the GB. Dislocation patterns of the bicrystal were observed by the electron channelling contrast technique. The two-phase structure of persistent slip bands (PSBs) and matrix (or veins) formed in both grains. The ladder-like PSBs were observed to transfer through the GB continuously on one surface of the bicrystal but piled-up at the GB on the other surface, showing a discontinuous dislocation distribution next to the GB. Several kinds of interaction between dislocations and the GB were observed on the common slip plane. The cyclic stress-strain response and the interactions between dislocations, PSBs and the GB are discussed.

Shear Fatigue Cracking of Twin Boundary and Grain Boundary Without Dislocation Impingement

Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary

Distinct Fatigue Cracking Modes of Grain Boundaries with Coplanar Slip Systems

Difference in fatigue cracking behaviors of Cu bicrystals with the same component grains but different twin boundaries

Influence of Grain Boundary on Fatigue Behavior of Ni-base Bicrystals

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

Deformation Behaviors of Cu Bicrystals with an Inclined Twin Boundary at Multiple Scales

Fatigue Cracking at Twin Boundaries: Effects of Crystallographic Orientation and Stacking Fault Energy

Grain boundary effects on the inelastic deformation behavior of bicrystals

A review on the fatigue cracking of twin boundaries: Crystallographic orientation and stacking fault energy

Cyclic Deformation and Fatigue Damage Behavior of Cu Monocrystals, Bicrystals and Tricrystals

A Close Observation on the Deformation Behavior of Bicrystal Copper under Tensile Loading

The Shear Response of Copper Bicrystals with Σ11 Symmetric and Asymmetric Tilt Grain Boundaries by Molecular Dynamics Simulation.

Orientation Dependence of the Cyclic Deformation Behavior and the Role of Grain Boundaries in Fatigue Damage in Copper Crystals

Tension/compression asymmetry of grain boundaries with non-planar structure

Elastic-plastic Stress Distribution Near Grain Boundary in Anisotropic Bicrystals and Tricrystals Considering Two Kinds of Grain Boundaries

Dislocation Arrangements Within Slip Bands During Fatigue Cracking

Cyclic Deformation Behaviour of A Copper Bicrystal with Common Primary Slip Planes

Shear Response of Grain Boundary Bicrystals with a Stacking Fault Tetrahedron

Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviors of Copper Tricrystal and Tetracrystals

Twin Boundary-Dislocation Interactions in Nanocrystalline Cu-30% Zn Alloys Prepared by High Pressure Torsion