Tuning the Quality Factor of Bulk Micromachined Structures Using Squeezed-Film Damping

C.-C. Cheng,W. Fang

DOI: https://doi.org/10.1007/s00542-004-0457-5

2005-01-01

Microsystem Technologies

Abstract:This report demonstrates the tuning the quality factor of a micromachined structure using the air damping of a small squeezed-film area (300 μm2 to 800 μm2). Two micromachining processes have successfully been established to fabricate novel stationary structures using thin films and bulk silicon, in which the stationary structure and a vibrating micromachined cantilever form a squeezed-film region. Measurements showed that, under the assistant of bulk silicon stationary structure, the quality factor of the vibrating beam decreased by 48% when the squeezed-film area was increased from 300 μm2 to 800 μm2 under a 760-torr ambient pressure. Moreover, even when the ambient pressure was only 20 mtorr, the quality factor of the beam still decreased by 20% for the same increase in area. Under the assistant of thin film stationary structure, the quality factor of the vibrating beam decreased by 35% when the squeezed-film area was increased from 300 μm2 to 500 μm2 under a 760-torr ambient pressure. Consequently, the proposed two stationary structures can be exploited to significantly alter the quality factor of dynamic systems.