Optimising bandwidth over deep sub-micron interconnect

Dinesh Pamunuwa,Li-Rong Zheng,Hannu Tenhunen
DOI: https://doi.org/10.1109/ISCAS.2002.1010422
2002-01-01
Abstract:In deep sub-micron (DSM) circuits proper analysis of interconnect delay is very important. When relatively long wires are placed in parallel, it is essential to include the effects of cross-talk on delay. In a parallel wire structure, the exact spacing and size of the wires determine both the resistance and the distribution of the capacitance between the ground plane and the adjacent signal carrying conduc- tors, and have a direct effect on the delay. Repeater inser- tion depending on whether it is optimal or constrained, affects the delay in different ways. Considering all these effects we show that there is a clear optimum configura- tion for the wires which maximises the total bandwidth. Our analysis is valid for lossy interconnects as are typical of wires in DSM technologies.
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