Low-latency low-power scheme for on-chip global interconnects

Xiangyuan Liu,Shuming Chen
2005-01-01
Abstract:A hybrid insertion scheme for on-chip global interconnects is presented. The scheme takes advantages of repeaters and low-swing differential-signaling circuits on driving long wires in different length, and optimally inserts them along the wire in order to decrease delay and power of interconnects. It is shown that the delay, energy, delay-energy-product, and area are all considerably decreased compared with other available schemes.
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