Abstract:It is well-known that both Performance and reliability of present-day RF integrated circuits (RFICs & MMICs) and even Nano electronic devices cannot be completely understood or accurately predicted from electromagnetic considerations alone. For example, the performance parameters, such as S-parameters, power handling capability and breakdown thresholds of high-density nano interconnects and RF modules are often affected by heat conduction and mechanical stresses/deformations, in extreme cases leading to electro-thermo-mechanical breakdown. Under such circumstances, predictive simulations must rely on multiphysics computational approaches as opposed to electromagnetics-only methods. There exist many challenges in developing computational algorithms for rapidly and accurately analyzing electro-thermal and electro-thermo-mechanical phenomena in RF as well as nano electronic components and circuits with complex geometries and new material properties. Most material parameters involved, such as carrier mobility, permittivity, permeability, electrical conductivity, thermal conductivity, and thermal expansion coefficients are applied field, temperature, and thermal stress dependent. On the other hand, there exist significant differences in length and time scales among electrical, thermal, and mechanical field actions. Therefore, special attention must be paid to the choice of spatial discretization and time stepping procedures to ensure convergent multiphysics solutions. This talk will address challenges and opportunities in computational multiphysics method and its application for RF and Nano electronics, with a series of examples given and demonstrated for the capability of time-domain finite element method and its implementation.

Three dimemsional electro-thermal coupled Monte Carlo device simulation

Electromagnetic-Circuital-Thermal Co-Simulation for Integrated Circuits and Microwave Applications

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Parallel Simulation of Electromagnetic and Thermal Characteristic in RF Component

Electromagnetic-Circuital-Thermal Multiphysics Simulation Method: A Review

Parallel Multiphysics Simulation for Characterizing Performance Degradation of RF Components

Massively Parallel Simulation Of Large-Scale Electromagnetic Problems Using One High-Performance Computing Scheme And Domain Decomposition Method

3D parallel full band ensemble Monte Carlo devices simulation for nano scale devices application

Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”

A Scalable HPC-Based Domain Decomposition Method for Multiphysics Modeling of RF Devices

Computational Multiphysics Method for Rf and Nano Electronics: Challenges and Opportunities

Electromagnetic-Thermal Co-simulation of Large Antenna Array on Platform Using Enhanced Finite Element Solver with Massively Parallel Computing Capability

Parallel Simulation of Fully Coupled Electrothermal Processes in Large-Scale Phase-Change Memory Arrays

A 3D Parallel Monte Carlo Simulator for Semiconductor Devices

Large-Scale Parallel DGTD and FETD Method for Transient Microwave Heating

Parallel Modeling Fully Coupled Multiphysics Process in Resistive Random Access Memory Array

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

Multiphysics Characterization of Large-Scale Through-Silicon-via Structures

ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity