Study of Electrical and Physical Properties of PrxAl2−xO3 As Metal-Oxide-semiconductor Gate Dielectric

Ziming Zhang,Huiqin Ling,Ming Li
DOI: https://doi.org/10.1109/icept.2014.6922651
2014-01-01
Abstract:The electrical and physical properties of PrxAl2-xO3 on metal-oxide-semiconductor gate dielectric were investigated. Amorphous PrxAl2-xO3 films with the thickness of 15 nm were deposited by electron-beam evaporation under a typical dielectric constant and equivalent oxide thickness of 18 and 3.3 nm, respectively. Leakage current decreased from 48mA/cm2 to 3.4mA/cm2 at a gate voltage of 1V after 500°C annealing. The films still remained amorphous after 900°C annealing for 5 min. A mixture of Pr, Al, O and Si observed at the interface between the film and the substrate was argued to be Pr-Al-silicate. Post-annealing is demonstrated to be essential for the films in order to get good electrical property.
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