An Improved SPICE Model of Phase-Change Memory (PCM) for Peripheral Circuits Simulation and Design

Yiqun Wei,Xinnan Lin
DOI: https://doi.org/10.1109/isicir.2014.7029548
2014-01-01
Abstract:An improved SPICE model is presented in this work, including three coupled modules, the electrical module, thermal module and the phase transition dynamic module. Considering the heterogeneous temperature distribution, a temperature distribution model and a distributed resistor network model based on the semispherical hypothesis of the active area are achieved. The model is submitted by Verilog-A language, and the peripheral drive circuit combined with the PCM cell is simulated. The results show a good fit with measurement. According to the simulation, the peripheral circuit for PCM cells with different structure is optimized.
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