Abstract:This study aimed to overcome the limitations posed by the quantity of ceramic nanoparticle in modifying leadfree solder from the process perspective. The research successfully employed vacuum thermal compression bonding to achieve the high-quality Cu/Sn58Bi-0.6B4C NPs/Cu interconnected solder joints rapidly. Concurrently, it investigated the impact of temperature gradients and thermomigration on their microstructure, interface intermetallic compounds (IMC), and mechanical performance. The research revealed that a wellcalibrated temperature setting effectively refines the size of beta-Sn and the Bi-rich phase and reduces the interfacial IMC thickness. A suitable reduction in temperature gradient significantly diminishes the difference in IMC thickness at both ends, thereby mitigating adverse effects. However, an overall increase in system temperature results in microstructure coarsening and IMC thickness increasing. Besides, the judicious temperature optimization substantially enhances the joints shear strength, which is closely related to changes in microstructure and IMC layers. Inconsistent temperature fluctuations between high and low-temperature regions, as well as an overall elevated system temperature, contribute to an increased propensity for stress concentration, leading to crack initiation and propagation. Under such conditions, a substantial abundance of Cu6Sn5 IMC grains is revealed on the fracture surface. Additionally, the vacuum environment effectively inhibits the formation of voids. In summary, utilizing vacuum thermal compression bonding, in conjunction with an appropriate temperature gradient, effectively enables the rapid and high-quality formation of interconnect solder joints.

Research on Nano-Thermocompression Bonding Process Using Nanoporous Copper As Bonding Layer

Research on Low Temperature Bonding Using Nanoporous Copper

Dealloyed Nanoporous Cu Films on Ceramic Substrate for Low Temperature Bonding

Low Temperature Thermocompression Bonding Based on Copper Nanostructure for 3D Packaging

A Novel Copper-Coated Ceramic Substrate Prepared by Nano Thermocompression Bonding

Low Temperature Cu-Cu Bonding Using Copper Nanoparticles Fabricated by High Pressure Pvd

Solderless Bonding with Nanoporous Copper As Interlayer for High-Temperature Applications.

In Situ Study on Cu-to-Cu Thermal Compression Bonding

Reliable Cu-Cu Thermocompression Bonding by Low Temperature Sintered Cu Nanowires

Low-temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging

An Exploratory Study to Achieve Cu Bump Bonding Structures with Assistance of Bimodal-sized Cu Nanoparticles by Low-Temperature Thermocompression Bonding in Air

Design of Cu Nanoaggregates Composed of Ultra-Small Cu Nanoparticles for Cu-Cu Thermocompression Bonding

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films

Low-temperature copper bonding strategy via hierarchical microscale taper array fabricated by femtosecond laser

Impacts of temperature gradient on microstructure and properties of Cu/ Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding

Rapid and Low Temperature Sintering Bonding Using Cu Nanoparticle Film for Power Electronic Packaging

Preparation and performances of nanoporous copper for low temperature bonding

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Facile Preparation of Cu Micro-Nano Composite Particle Paste for Low Temperature Bonding

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging