Alleviating Thermal Constraints While Maintaining Performance Via Silicon-Based On-Chip Optical Interconnects
Nicholas Nelson,Gregory Briggs,Mikhail Haurylau,Guoqing Chen,Hui Chen,David H. Albonesiy,Eby G. Friedman,Philippe M. Fauchet
DOI: https://doi.org/10.1201/9781420051759.ch14
2005-01-01
Abstract:The relentless pursuit of Moore's Law by the semiconductor industry has yielded signican t in- creases in performance, but at the cost of greater power dissipation. As CMOS technology continues to scale, increasing power densities, or \hot spots," particularly in dense logic structures, may limit fre- quencies below projected targets in order to avoid circuit malfunction. A solution to this problem is to separate the hot spots by interleaving these units with cooler cache banks. This approach, how- ever, increases the distance among processing func- tions, which can signican tly degrade performance. While eort is made to localize communication as much as possible, global communication cannot be completely avoided, particularly in parallel appli- cations. In this paper, the use of silicon-based on-chip optical interconnects is investigated for minimizing the performance gap created by separating process- ing functions due to thermal constraints. Mod- els of optical components are presented, and used to connect the common front-end with the dis- tributed back-ends of a large-scale Clustered Multi- Threaded (CMT) processor. A signican t reduc- tion in thermal constraints (translated into an in- crease in clock frequency), combined with improved instructions per cycle (IPC), is demonstrated over a conventional all-electrical system.