Abstract:Burn-in is used to force the failure of marginal devices before using into products. Usually devices are placed in a burn-in oven. The burn-in time mainly depends on the device junction temperature, so the junction temperature control is very important during burn-in test. Usually the oven ambient temperature is closed-loop controlled during burn-in, but the device junction temperature is open-loop, not accurately controlled. Consequently some devices may be at a lower temperature (junction temperature lower than required) and others may be at a higher temperature (junction temperature higher than required) in the same burn-in oven. Latest silicon processing technology results in significant power variations between chips produced even on the same wafer, thus some devices with higher power dissipation will be burned at a hotter temperature, which means a potential for thermal runaway. At the same time, high leakage currents that are rapidly increasing with technology scaling become more crucial during burn-in test with stressed voltage and temperature applied, and excessive leakage may lead to higher junction temperatures, possible thermal runaway. Thermal runaway means temperature increases uncontrollably and can result in damage to the socket. To solve above problems and avoid thermal runaway, each device junction temperature should be stable during burn-in test. Controlling the device junction temperature accurately by each socket is a solution. This paper describes a closed-loop device case temperature control system, which can ensure that the device junction temperature is stable. Each socket becomes a controlled environment during burn-in test for a wide range of influences, for example, process variations and ambient temperatures. Once disturbance occurs, for example, the burn-in oven temperature change, the control system with better dynamic response can get the case temperature quickly back to stable.

Thermal management of integrated circuits in burn-in environment

An Device Case Temperature Closed-Loop Control System During Burn-in Test

Design of Temperature Testing System in Multi-Parameter Combined Environmental Test

Closed-loop Temperature Control System for a PEM During Burn-in

Preliminary study of burn-in method for surface mounted and plastic encapsulated device

Burn-in Method Study of Surface Mounted Plastic Encapsulated Devices and Board-Level Verification

Self-heating Burn-in Pattern Generation Based on the Genetic Algorithm Incorporated with a BACK-like Procedure.

A Junction Temperature Monitoring Method for IGBT Modules Based on Turn-Off Voltage with Convolutional Neural Networks

A review of studies of burn-in of plastic encapsulated devices

Thermal-aware small-delay defect testing in integrated circuits

Factors for Negative Bias Temperature Instability Improvement in Deep Sub-Micron CMOS Technology

Temperature-Aware NBTI Modeling Techniques in Digital Circuits.

Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

Self-heating effects in integrated circuits with hot spot method and electro-thermal coupling method

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill

Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials

Study on Self-Heat Effects in Integrated Circuits with Hot-Spot and Electro-Thermal Coupling Methods

Three Dimensional ICs Thermal-Driven Test Application Scheme

On-Line Measurement of Chip Temperature Based on Blocking Leakage Current of the Insulated-Gate Bipolar Transistor Module in the High-Temperature Reverse-Bias Test

A genetic algorithm based method for the uniformity of power in SoC during dynamic burn-in

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs